Intel Panther Lake18A (16th Gen) Advanced Packaging Quick Look

Advanced Packaging Quick Look of the Intel Core Ultra X7 358H microprocessor, packaged using Foveros-S 2.5D packaging technology.

This is an Advanced Packaging Quick Look (APQ) summary for the Intel Core Ultra X7 358H microprocessor found within the MSI Prestige 14 Flip AI+ laptop. It is packaged using Foveros-S 2.5D packaging technology, in which the three active tiles—compute, graphics, and platform controller— are mount face-down on a passive silicon interposer base tile. The compute tile, fabricated on Intel's 18A process node, represents Intel's first high-volume client implementation of RibbonFET gate-all-around transistor technology and PowerVia backside power delivery.