Mediatek Dimensity 9500 Advanced Packaging Quick Look
2 Min Read February 13, 2026
This advanced packaging quick look of MediaTek Dimensity 9500 demonstrates advanced packaging techniques and features cutting edge MT6993Z processor.
TechInsights' Advanced Packaging Quick Look (APQ) reveals the MediaTek Dimensity 9500 package-on-package (PoP) architecture, featuring a cutting-edge MT6993Z processor manufactured using 3-nanometer process technology and a Samsung LPDDR5X memory package. Deployed in Vivo X300 Pro and OPPO Find X9 Pro 5G smartphones, this PoP assembly demonstrates advanced semiconductor packaging techniques with a sophisticated multi-die integration strategy.
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