Explore the Qualcomm HG11-48949-210 die inside the QCC730, an ultra-low power Wi-Fi 4 component designed for efficient IoT connectivity in this detailed analysis.
The Qualcomm HG11-48949-210 die was found inside the ultralow power (ULP) Wi-Fi 4 Qualcomm QCC730 component. The QCC730 component is positioned as representative device for low-power IoT connectivity.
Unpacking the Semiconductor Pricing Battle
Gain exclusive access to data-backed analysis of Power, DRAM, and NAND market pricing shifts—plus supplier strategies and future forecasts.
Inside the Future of Wearables | Teardown Insights & Market Trends eBook
Discover what's powering next-gen wearables. Get teardown insights, sensor trends, and strategic analysis in our free TechInsights eBook—built for tech leaders.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
Stay informed on the latest shifts in semiconductor policy, AI, packaging, and market dynamics in the June 2025 Chip Observer, featuring insights on Qualcomm, OpenAI, Huawei, and more.
