Explore the Qualcomm HG11-48949-210 die inside the QCC730, an ultra-low power Wi-Fi 4 component designed for efficient IoT connectivity in this detailed analysis.
The Qualcomm HG11-48949-210 die was found inside the ultralow power (ULP) Wi-Fi 4 Qualcomm QCC730 component. The QCC730 component is positioned as representative device for low-power IoT connectivity.
TechInsights Experts Analyze the Impact on Supply Chains, Costs, and Market Winners in a Rapidly Shifting Semiconductor Landscape.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
Stay informed on the latest shifts in semiconductor policy, AI, packaging, and market dynamics in the June 2025 Chip Observer, featuring insights on Qualcomm, OpenAI, Huawei, and more.
US Tariffs and Taiwan Curbs Reshape Semiconductor Supply
Trump’s tariff threat and Taiwan’s export curbs on Huawei and SMIC add new risks and delays to global semiconductor supply chains and chip manufacturing plans.
