The analysis you need to keep pace with this rapidly growing market
The Lithium-Ion battery market is expected to grow from $31B in 2019 to reach $1 trillion in 2026 ([1] Research and Markets) driven by smartphones, electric vehicles, laptops, power storage, rechargeable tools.
Even with this level of success, battery technologies continue to evolve to address several key challenges:
- Battery life
- Energy density/weight
- Battery Safety
- Cost reduction
- Charging speed
- Temperature performance
- Battery management complexity
The innovation seen in a typical battery system can cross a number of technology domains including:
- Battery electronics and management systems and the corresponding semiconductor componentry including controllers, sensors, voltage regulators, state monitors
- Battery pack structure, including cell types, cell configuration, internal connections and packaging
- Cell materials analysis and measurements of cathode, anode, electrolyte and separator
Battery Analysis Subscription
TechInsights provides custom analysis to address your specific battery analysis programs.
Battery Analysis
Product (eg. Phone) or Pack Teardown and Cost Analysis
Teardown analysis of battery pack and battery management systems from a wide range of mobile phones, laptops, tablets, automobiles and other devices
- Design win and bill of material data (cells and Battery IC)
- Materials costing estimates
Battery Cell Analysis
TechInsights provides a wide range of technical analysis covering battery cells and materials
- Computerized tomography x-ray (CT) of battery cell structures/volume
- Cell Cross Sectional Analysis: Covers internal structure of the battery including Optical and SEM and SEM-EDS imaging
- Plan-view SEM materials analysis to identify size and layered structure of particles
- TEM and TEM-EDS Materials Analysis
- Time-of-flight secondary ion mass spectrometry (TOF-SIMS)
- X-ray photoelectron spectroscopy (XPS)
- Fourier Transform Infrared Spectroscopy (FTIR) and RAMAN analysis
- X-ray diffraction (XRD) analysis
- Inductive Plasma (ICP) analysis
- Gas chromatography mass spectrometry (GC-MS)
A Review of the Chevy Bolt Powertrain
Electric vehicles (EV) are potentially a disruptive technology in the automotive market. They offer the promise of increased energy efficiency and the potential for reduced emissions, depending on the primary energy source used to generate the electricity. TechInsights recently completed some analysis of parts of the Chevrolet Bolt EV.
The World of Lithium Ion Batteries
Lithium ion (Li-ion) batteries are one of the most widely used rechargeable battery types, especially for mobile devices such as smartphones, tablets and laptops, and in electric vehicle applications. The continually growing interest in Li-ion technology and applications translates to a forecast CAGR of over 20%, and a market of approximately $100 billion by 2025.
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Recent News and Blogs
Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) - Memory Blog
April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in16Apr
World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin
March 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 131Mar
TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis
March 23, 2021 Abdullah Rahal TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis TechInsights’ analysts have examined the Blackberry patent portfolio and partitioned it into a dozen application areas23Mar
KIOXIA’s new XL-FLASH for ultra-low latency NAND application
March 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high23Mar
Dynamic Vision Sensors – A Brief Overview - Image Sensor TechStream Blog
March 16, 2021 Ziad Shukri Dynamic Vision Sensors – A Brief Overview Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture. With DVS, individual18Mar
Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies
March 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive16Mar
A New and advanced ReRAM from Fujitsu
March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The11Mar
GaN USB-C Charger Market Heating Up in 2021
March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights10Mar
Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary
March 03, 2021 Dr Peter Gammon Power Technology Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary SiC power devices have the potential to reach voltage ratings beyond 30 kV, yet today, SiC chip manufacturers are focussed on03Mar
Webinar: Selected Imager and Sensor Trends and Comparisons
March 3, 2021 Image Sensor Technology Webinar: Selected Imager and Sensor Trends and Comparisons Now on-demand! The intent of this webinar is to share selected content from our 2020 Image Sensor Device Essentials (DEF) subscription annual03Mar
LiDAR 101 – Solid-State and Mechanical LiDARs
February 19, 2021 Automotive Technology LiDAR 101 – Solid-State and Mechanical LiDARs 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster19Feb
Webinar: Gearing Up for the Electric Vehicle (EV) Revolution
Presented by: Stephen Russell & TechInsights Power Subscription Gearing Up for the Electronic Vehicle (EV) Revolution State of the Art Power Devices The global drive towards green energy is accelerating. Ten years ago, electric vehicles (EVs) were a03Feb
Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market
February 03, 2021 Logic Disruptive Technology Download the brief Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings03Feb
Samsung Galaxy S21 – rival 5 nm solutions, new design wins, and LPDDR5 with 1z EUV?
February 02, 2021 Teardown Disruptive Technology Samsung Galaxy S21 – rival 5 nm solutions, new design wins, and LPDDR5 with 1z EUV? Right from the release announcement, it seemed the Samsung Galaxy S21 flagship phone was going to be a little bit02Feb
A Recap of Samsung’s 108MP Image Sensors - Image Sensor TechStream Blog
February 02, 2021 Ziad Shukri A Recap of Samsung’s 108MP Image Sensors In 2019, Samsung introduced the first 108MP image sensor for mobile applications – the S5KHMX with ISOCELL Plus® technology. We first confirmed its use in the rear (wide) cam of02Feb
TechInsights Cracks Open the STMicroelectronics MasterGaN2 - Power TechStream Blog
February 02, 2021 Sinjin Dixon-Warren TechInsights Cracks Open the STMicroelectronics MasterGaN2 TechInsights recently completed a full analysis of the STMicroelectronics MasterGaN1. We found that the device contained two identical GaN Systems dies02Feb
Intel Shows Early Ponte Vecchio Part - Logic TechStream Blog
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Supporting IP strategy in the semiconductor industry
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Sony d-ToF Sensor found in Apple’s new LiDAR camera
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HiSilicon’s move towards an antenna to modem solution - Mobile RF TechStream Blog
January 12, 2021 John Sullivan HiSilicon’s move towards an antenna to modem solution HiSilicon provides the RF transceiver and mobile SoC for Huawei’s mobile handsets but the RF front end has traditionally been sourced from the usual front end12Jan
Intel Launches 2nd-Gen 3D XPoint Memory, Discusses at IEDM - Memory TechStream Blog
December 28, 2020 Dick James Intel Launches 2nd-Gen 3D XPoint Memory, Discusses at IEDM On Dec 16th Intel held a "Memory & Storage Moment"" where they announced five new memory and storage products; two Optane™ SSDs, one for data centers, and one28Dec
Toshiba Integrated Diode into SiC MOSFET - Power TechStream Blog
December 21, 2020 Stephen Russell Toshiba Integrated Diode into SiC MOSFET Every silicon carbide (SiC) manufacturer seemingly has their own approach to FET fabrication. Be it planar, trench, JFET, etc. there is no dominant design throughout the21Dec
Analysis of Apple M1 is Happening – and, Thermal Imaging?
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Webinar: Increasing Value of Semiconductor IP in the Automotive Supply Chain
Increasing Value of Semiconductor IP in the Automotive Supply Chain Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge17Dec
Two new Apple SoCs, two market events: Apple A14 and M1
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Teardown: Velodyne Lidar Puck VLP-16 sensor (Electronics360)
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Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters
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3D flash memory, 176 layers!
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Wireless Charging Speeds Up - Teardown TechStream Blog
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Webinar: Memory Technology 2020 and Beyond - NAND, DRAM, Emerging and Embedded Memory Technology Trends
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Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12
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Inside the STMicroelectronics MasterGaN1 Integrated GAN High Voltage Half-Bridge -TechStream Power Semiconductor Blog
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Micro Loading And Its Impact On Device Performance
How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA profile.02Nov
Webinar: ALD/ALE Process in Commercially Available Memory Devices
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October Apples: Apple iPhone 12 Pro Teardown - Teardown TechStream Blog
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iPhone Camera History: iPhone 12's Alternative and Normal
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New GDDR6X from Micron - Memory TechStream Blog
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STMicroelectronics Displaces Sony ToF in Galaxy Note Series - Image Sensor TechStream Blog
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A New Player Emerges in the GaN Charger Market – Innoscience INN650D02 Found Inside the Rock RH-PD65W USB-C Charger
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Avalanche 40 nm pMTJ STT-MRAM - Memory TechStream Blog
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Hybrid Bonding Expands from Image Sensors to Logic, Memory - Image Sensor, Logic & Memory TechStream Blog
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Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing
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SK hynix 128L 3D PUC NAND (4D NAND)
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Inside the Intel RealSense L515 LiDAR Camera
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Webinar: ALD/ALE Process in Commercially Available Logic Devices
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60 years of the Semiconductor industry and its changing patent strategy
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A Review of the Chevy Bolt Powertrain
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Memory Process Webinar: 3D NAND Word Line Pad (WLP)
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Intel’s 10nm Node: Past, Present, and Future – Part 2
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Apple Computers: Transitioning to ARM Chips is Coming Soon
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On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN
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Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
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Patent Portfolio Management: Effective Strategies and Best Practices in 2020
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Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services
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Looking at the Apple A12Z Bionic System on Chip
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TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990
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Recent Analysis of Samsung’s Mobile RF Components
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If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
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In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
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新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。04Jan
Apple Is About to Add a Third OLED Supplier
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What’s Next For High Bandwidth Memory
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Seoul Semiconductor patent auction analysis reveals a mixed bag of assets
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Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process
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DRAM Scaling Challenges Grow
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Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
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Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors
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TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
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Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis
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The Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated
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TechInsights: iPhone 11 Pro Max Cameras Cost $73.5
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How e-mobility is changing the Automotive
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E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars
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SK hynix 96L 3D PUC NAND Analysis
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TechInsights Analyses iPhone 11 Cameras
TechInsights publishes a teardown report of the new Apple iPhone 11 Pro Max smartphone with some info on its cameras:26Sep
Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.26Sep
Patent licensing: The patent battleplan
Successful, high-return patent licensing programmes require planning. Peter Hanschke of TechInsights offers a guide to getting it right.23Sep
Webinar: Preparing to License: Using tools to Scale Your Licensing Program
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Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
Posted: September 17, 2019 With 2018 revenue of $30.4B USD, 16.5% market share in NAND Flash Memory, and 23% market share in DRAM, Micron is one of the biggest players in storage and memory technology. For those looking to support their product17Sep
How Graphical Solutions Improve 3D NAND Effective Device Density
Driven by Moore's Law, memory and logic chip semiconductor manufacturers reduce product cost and improve performance by increasing transistor density.16Sep
Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis
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Lithium, the white gold of technology
The price of the mineral collapses, but the batteries continue to consume this white king.10Sep
Mobile manufacturing: How much do companies earn with the high end?
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Peloton IPO Preview: All Hype, No Muscle
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Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las02Sep
A high-end mobile phone sells almost three times what it costs to manufacture it
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Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.31Aug
Why I keep writing ’bout holes in the sensor
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Deca Technologies Fan-In WLP in Qualcomm PM8150
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Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive22Jul
AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.16Jul
Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 201910Jun
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was05Jun
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges31May
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
