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Available Memory - NAND & DRAM Subscriptions
TechInsights Memory offerings have been developed to provide the focused technical intelligence you need based on your industry and role.
DRAM Functional Analysis (MFR)
Includes:
- Executive summary supported with image sets
- Process node and foundry identification
- Critical dimensions
- Functional block summary
- Stacked optical top metal and poly die photo delivered in CircuitVision. Includes calibrated measurement and annotations tools
- SEM cross-sectional and bevel imaging
- 13-15 reports/year
DRAM: SWD and Sense Amp Transistor Characterization
Includes:
- Transitor Characterization Report (TCR)
- Universal curves for IOFF vs. ION and IOFF vs. ID, LIN derived from
- 5 NMOS and 5 PMOS sub wordline driver transistors, across multiple VDD at 85°C
- 5 NMOS and 5 PMOS sense amp transitors, across multiple VDD at 85°C
- For each universal curve data point
- Transistor Characteristics: ID, SAT, ID, Lin, Ioff, VT, Lin & VT, SAT, ΔVGS, Gm, SS, DIBL
- Output Characteristics
- Universal curves for IOFF vs. ION and IOFF vs. ID, LIN derived from
- Analysis Coverage
- 4 reports/year
- Trend Analysis
- 4 hrs support
DRAM Periphery Design (MDP): Sense Amp, Sub Wordline Driver
Includes:
- Concise analyst's summary of critical device metrics
- Circuit schematic diagram of sense amplifier
- Circuit schematic diagram of a sub wordline driver
- Detailed stacked SEM images of a delayered DRAM sense amplifier and sub wordline driver delivered in CircuitVision. Includes calibrated measurement and annotation tools
- ~4 reports/year
DRAM: Circuit Analysis
Includes:
- Full Circuit Analysis
- 1 - Memory Array and Peripherals
- 2 - Address Path
- 3 - Data Path
- 4 - Control Blocks, Configuration and Test Block
- 5 - Voltage Generators System
- Analysis Coverage
- Full 2/year
NAND Functional Analysis
Includes:
- Analysis Coverage
- Executive summary supported with image sets
- Process Node and Foundry Identification
- Critical Dimensions
- Functional Block Summary
- Stacked optical top metal and poly die photo delivered in CircutVision which includes calibrated measurement tools
- SEM cross-sectional imaging
- 13-15 reports/year
- Executive summary supported with image sets
NAND Periphery Design (MDP): Page Buffer, Wordline Driver
Includes:
- Concise analyst's summary of critical device metrics
- Circuit schematic diagram of a page buffer: decoder, switch, and controller
- Circuit schematic diagram of a wordline driver: decoder and switch
- Detailed stacked plan view SEM images of a beveled NAND page buffer and wordline driver delivered in CircuitVision. CircuitVision includes calibrated measurement and annotation tools
- ~4 reports/year
NAND: Circuit Analysis
Includes:
- Full Circuit Analysis
- 1 - Memory Array and Peripherals
- 2 - Address Path
- 3 - Data Path
- 4 - Control Blocks, Configuration and Test Block
- 5 - Voltage Generators System
- Analysis Coverage
- Full 2/year
NAND Internal Waveform Analysis
This channel examines the waveforms used on NAND memory cells during program, read and erase cycles.
- Delivers 8 reports over a 12-month period as well as an online seminar
- Provides a Waveform summary PDF and raw waveform .sht files to enable the customer to perform further analysis and measurements
Advanced Process
Includes:
- Advanced Memory Essentials (AME)
- Focused on leading edge NAND and DRAM memory technology
- Executive summary supported by large image sets
- SEM cross-sectional and bevel imaging
- TEM cross-sectional analysis with TEM EDS
- 8 reports/year
- Analysis Coverage
- Technical trend/roadmap by technology element
- Design technology interaction analysis
- Detailed explanation of process integrations
- Next node predictions
- 3 briefings/year
- Trend analysis
- Forecasting
- 1 annual seminar
- 4 hrs support
Process Flows
*Requires Advanced Process Subscription
Includes:
- Process Flow Analysis (PFA)
- Spreadsheets showing process, architecture, mask list, and integration-level process steps
- 8 Memory / year
- Process Flow Full Emulation (PFF)
- PFA content may be updated
- Layout GDS fully decomposed into process layers
- 3D Emulation
- Synopsys Input (Route-Level Deck)*
*Requires Synopsys license to view and modify - 6 Memory / year
- Analysis Coverage
- Cell Design technology interaction analysis
- Detailed explanation of process integration from wafer-in through wafer-out
- Process steps, materials, equipment type, unit process
- SEM and TEM cross-sectional and top-view images
- Layer annotations, specific process module, assumption
- Trend analysis
- +4 hrs support
NAND Transistor Characterization
Includes:
- 4 NAND devices analyzed per year
- 9 types of transistors characterized at 85°C for each NAND device:
[1] Measured at Sensing LatchTR Characterization Category Target TR Core PGBUF 1 PB LV Tr. (NMOS) [1] 2 PB LV Tr. (PMOS) 3 PB HV Tr. (BLSLT) 4 PB HV Tr. (BLGIDL) XDEC 5 Pass Tr. Perl I/O 6 Thin NMOS (Output Drv.) [2] 7 Thin PMOS (Output Drv.) [2] Analog HV (measured from XDEC) 8 HVP 9 HVD
[2] If the NAND is Dgox based, Mid N/PMOS - 4 reports/year
- Trend Analysis
- 4 hrs support
TechInsights Platform
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Search our analysis and website
| Related Analysis | Manufacturer | Analysis Type | Subscription Channel |
|---|---|---|---|
| Samsung D1x 4 Gb LPDDR4X Memory Floorplan Analysis | Samsung | Floorplan | Memory - DRAM Floorplan Analysis |
| Micron Gen2 D1y 8 Gb GDDR6 Memory Floorplan Analysis | Micron Technology | Floorplan | Memory - DRAM Floorplan Analysis |
| MXIC 19nm SLC NAND Flash Memory Floorplan Analysis | Macronix | Floorplan | Memory - NAND Floorplan Analysis |
| Samsung 128L NAND die (K9AFGD8U0C) Process Flow Analysis | Samsung | Circuit | Memory - Process Flow Analysis |
| Samsung 128L NAND die (K9AFGD8U0C) Process Flow Full | Samsung | Process | Memory - Process Flow Analysis |
| Samsung 2nd-gen HBM2 8 Gb TSV die Memory Floorplan Analysis | Samsung | Floorplan | Memory - DRAM Floorplan Analysis |
| Samsung 12 Gb 1z EUV LPDDR5 Process Flow Analysis | Samsung | Process | Memory - Process Flow Analysis |
| Samsung 12 Gb 1z EUV LPDDR5 Memory Floorplan Analysis | Samsung | Floorplan | Memory - DRAM Floorplan Analysis |
| Samsung 12 Gb 1z EUV LPDDR5 Advanced Memory Essentials | Samsung | Process | Memory - Process |
| Samsung 12 Gb 1z EUV LPDDR5 Transistor Characterization | Samsung | Functional - Testing | Memory - DRAM SWD and SA Transistor Characterization |
Recent News and Blogs
Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) - Memory Blog
April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in16Apr
World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin
March 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 131Mar
TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis
March 23, 2021 Abdullah Rahal TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis TechInsights’ analysts have examined the Blackberry patent portfolio and partitioned it into a dozen application areas23Mar
KIOXIA’s new XL-FLASH for ultra-low latency NAND application
March 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high23Mar
Dynamic Vision Sensors – A Brief Overview - Image Sensor TechStream Blog
March 16, 2021 Ziad Shukri Dynamic Vision Sensors – A Brief Overview Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture. With DVS, individual18Mar
Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies
March 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive16Mar
A New and advanced ReRAM from Fujitsu
March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The11Mar
GaN USB-C Charger Market Heating Up in 2021
March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights10Mar
Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary
March 03, 2021 Dr Peter Gammon Power Technology Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary SiC power devices have the potential to reach voltage ratings beyond 30 kV, yet today, SiC chip manufacturers are focussed on03Mar
Webinar: Selected Imager and Sensor Trends and Comparisons
March 3, 2021 Image Sensor Technology Webinar: Selected Imager and Sensor Trends and Comparisons Now on-demand! The intent of this webinar is to share selected content from our 2020 Image Sensor Device Essentials (DEF) subscription annual03Mar
LiDAR 101 – Solid-State and Mechanical LiDARs
February 19, 2021 Automotive Technology LiDAR 101 – Solid-State and Mechanical LiDARs 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster19Feb
Webinar: Gearing Up for the Electric Vehicle (EV) Revolution
Presented by: Stephen Russell & TechInsights Power Subscription Gearing Up for the Electronic Vehicle (EV) Revolution State of the Art Power Devices The global drive towards green energy is accelerating. Ten years ago, electric vehicles (EVs) were a03Feb
Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market
February 03, 2021 Logic Disruptive Technology Download the brief Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings03Feb
Samsung Galaxy S21 – rival 5 nm solutions, new design wins, and LPDDR5 with 1z EUV?
February 02, 2021 Teardown Disruptive Technology Samsung Galaxy S21 – rival 5 nm solutions, new design wins, and LPDDR5 with 1z EUV? Right from the release announcement, it seemed the Samsung Galaxy S21 flagship phone was going to be a little bit02Feb
A Recap of Samsung’s 108MP Image Sensors - Image Sensor TechStream Blog
February 02, 2021 Ziad Shukri A Recap of Samsung’s 108MP Image Sensors In 2019, Samsung introduced the first 108MP image sensor for mobile applications – the S5KHMX with ISOCELL Plus® technology. We first confirmed its use in the rear (wide) cam of02Feb
TechInsights Cracks Open the STMicroelectronics MasterGaN2 - Power TechStream Blog
February 02, 2021 Sinjin Dixon-Warren TechInsights Cracks Open the STMicroelectronics MasterGaN2 TechInsights recently completed a full analysis of the STMicroelectronics MasterGaN1. We found that the device contained two identical GaN Systems dies02Feb
Intel Shows Early Ponte Vecchio Part - Logic TechStream Blog
February 01, 2021 Dick James Intel Shows Early Ponte Vecchio Part Occasionally we will see something in the media that we think worth commenting on, and post as an “In Case You Missed It” (ICYMI) blog. In this case it was a Twitter post by Intel’s01Feb
Supporting IP strategy in the semiconductor industry
Supporting IP strategy in the semiconductor industry Growing complexity of the chip market has made it harder than ever for intellectual property owners to monitor developments, making reverse engineering a crucial process The breadth of reverse27Jan
Sony d-ToF Sensor found in Apple’s new LiDAR camera
January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry19Jan
HiSilicon’s move towards an antenna to modem solution - Mobile RF TechStream Blog
January 12, 2021 John Sullivan HiSilicon’s move towards an antenna to modem solution HiSilicon provides the RF transceiver and mobile SoC for Huawei’s mobile handsets but the RF front end has traditionally been sourced from the usual front end12Jan
Intel Launches 2nd-Gen 3D XPoint Memory, Discusses at IEDM - Memory TechStream Blog
December 28, 2020 Dick James Intel Launches 2nd-Gen 3D XPoint Memory, Discusses at IEDM On Dec 16th Intel held a "Memory & Storage Moment"" where they announced five new memory and storage products; two Optane™ SSDs, one for data centers, and one28Dec
Toshiba Integrated Diode into SiC MOSFET - Power TechStream Blog
December 21, 2020 Stephen Russell Toshiba Integrated Diode into SiC MOSFET Every silicon carbide (SiC) manufacturer seemingly has their own approach to FET fabrication. Be it planar, trench, JFET, etc. there is no dominant design throughout the21Dec
Analysis of Apple M1 is Happening – and, Thermal Imaging?
Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to21Dec
Webinar: Increasing Value of Semiconductor IP in the Automotive Supply Chain
Increasing Value of Semiconductor IP in the Automotive Supply Chain Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge17Dec
Two new Apple SoCs, two market events: Apple A14 and M1
Available Logic Subscriptions > Process & Advanced Packaging > Process Flows > Transistor Characterization > SoC Design Analysis > Digital Floorplan Analysis > Analytics - Digital Floorplan > Standard Cell GDS Library Analysis > Transistor16Dec
Teardown: Velodyne Lidar Puck VLP-16 sensor (Electronics360)
A deep dive into the major components used in the light detection and ranging technology. Posted in Electronics360.14Dec
Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters
Emerging GaN Technology in USB-C Power Delivery Adapters This event was presented by Sinjin Dixon-Warren & TechInsights Power adapters with a USB connection are ubiquitous in modern life. The wonderful mobile devices we use require regular connection09Dec
3D flash memory, 176 layers!
So far, NAND Flash has shown a white-hot stage. Not long ago, storage vendors were still "seeing the scenery on the high platform of flash memory" with 128 layers.09Dec
Wireless Charging Speeds Up - Teardown TechStream Blog
Stacy Wegner, Senior Technology Analyst Stacy Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive08Dec
Webinar: Memory Technology 2020 and Beyond - NAND, DRAM, Emerging and Embedded Memory Technology Trends
Memory Technology 2020 and Beyond NAND, DRAM, Emerging and Embedded Memory Technology Trends This webinar was presented by TechInsights In this webinar, Dr. Jeongdong Choe will present his detailed review of the latest NAND, DRAM, emerging and02Dec
Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12
An Examination of the Technical and Financial Implications of the Apple iPhone 12 This webinar was presented by TechInsights Join TechInsights and Bloomberg Intelligence Analysts as they share their technical and financial insights on Apple’s most10Nov
Inside the STMicroelectronics MasterGaN1 Integrated GAN High Voltage Half-Bridge -TechStream Power Semiconductor Blog
Sinjin Dixon-Warren, Senior Process Analyst Sinjin Dixon-Warren is a Senior Process Analyst at TechInsights with over 20 years of experience with semiconductor analysis and is a Subject Matter Expert (SME) for Power Electronics Analysis. He holds a03Nov
Micro Loading And Its Impact On Device Performance
How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA profile.02Nov
Webinar: ALD/ALE Process in Commercially Available Memory Devices
ALD/ALE Process in Commercially Available Memory Devices 2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices. This presentation will28Oct
October Apples: Apple iPhone 12 Pro Teardown - Teardown TechStream Blog
Stacy Wegner, Senior Technology Analyst Stacy Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive26Oct
iPhone Camera History: iPhone 12's Alternative and Normal
The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last21Oct
New GDDR6X from Micron - Memory TechStream Blog
Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog15Oct
STMicroelectronics Displaces Sony ToF in Galaxy Note Series - Image Sensor TechStream Blog
Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. October 11, 2020 Samsung11Oct
A New Player Emerges in the GaN Charger Market – Innoscience INN650D02 Found Inside the Rock RH-PD65W USB-C Charger
Contributed by: Sinjin Dixon-Warren, PhD The emergence of gallium nitride (GaN) technology in the USB-C chargers is a new trend in the semiconductor market. Over the past year, TechInsights has found GaN technology from Navitas and from Power08Oct
Quick View on Samsung 128L (136T) 3D V-NAND - Memory TechStream Blog
Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog08Oct
UnitedSiC Takes the Road Less Travelled with their SiC JFET Technology - Power Semiconductor TechStream Blog
Sinjin Dixon-Warren, Senior Process Analyst Sinjin Dixon-Warren is a Senior Process Analyst at TechInsights with over 20 years of experience with semiconductor analysis and is a Subject Matter Expert (SME) for Power Electronics Analysis. He holds a08Oct
Avalanche 40 nm pMTJ STT-MRAM - Memory TechStream Blog
Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog25Sep
Hybrid Bonding Expands from Image Sensors to Logic, Memory - Image Sensor, Logic & Memory TechStream Blog
Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to25Sep
Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing
Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying23Sep
DRAM, 3D NAND Face New Challenges
Semiconductor Engineering - Various memories and business outlooks are all over the map, sometimes literally, with lots of confusion ahead.21Sep
SK hynix 128L 3D PUC NAND (4D NAND)
SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral14Sep
Inside the Intel RealSense L515 LiDAR Camera
Introduction The world of LIDAR sensing is evolving. Rotating turret LiDARs are commonplace for applications such as autonomous driving (see our Automotive LIDAR teardown subscription), but they are being displaced by a new generation of solid-state11Sep
Webinar: ALD/ALE Process in Commercially Available Logic Devices
ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards26Aug
Samsung S5K33D i-ToF with 7 µm Pixel Global Shutter - Image Sensor TechStream Blog
Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. August 12, 2020 Our teams12Aug
60 years of the Semiconductor industry and its changing patent strategy
Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device04Aug
A Review of the Chevy Bolt Powertrain
Posted: July 09, 2020 Contributed by: Sinjin Dixon-Warren, PhD Electric vehicles (EV) are potentially a disruptive technology in the automotive market. They offer the promise of increased energy efficiency and the potential for reduced emissions09Jul
Memory Process Webinar: 3D NAND Word Line Pad (WLP)
Wednesday June 24, 2020 / 2:00 p.m. ET Hosted By: Chi Lim Tan 3D NAND, or vertical NAND, with its higher density and lower cost per bit, has been a driving force in the popularity of solid state drives (SSD) thanks to the innovation and continued24Jun
Intel’s 10nm Node: Past, Present, and Future – Part 2
Some say that in the H2 2017 – H1 2018 timeframe Intel’s 10nm node were so half baked, that Intel had to significantly redesign its 10 nm process technology for subsequent products. In any case, one SKU and limited availability speak for themselves.17Jun
Apple Computers: Transitioning to ARM Chips is Coming Soon
Quand on dit ce mois-ci, c’est à l’occasion de la Conférence des développeurs qui se tiendra dans la semaine du 22 juin, un événement très important appelé WWDC ou Worldwide Developers Conference qui se tient en Californie, à San José ou à San11Jun
Revisiting the Seminal APA Optics GaN HEMT Patent
Posted: June 05, 2020 Contributed by: Sinjin Dixon-Warren, PhD The power electronics industry is in a period of transition. For many years silicon-based devices have dominated the industry, with conventional Si MOSFET transistors being used for lower05Jun
Panasonic’s expertise in patent monetisation has never been more important
Like many other businesses, the Japanese heavyweight is under significant financial pressure thanks to the covid-19 pandemic, but its long track record of leveraging its IP assets could prove a saving grace05Jun
On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN
Wednesday May 27, 2020 / 2:00 p.m. ET Hosted By: Sinjin Dixon-Warren The power electronics industry is in a period of transition. For many years silicon-based devices dominated the industry, with conventional Si MOSFET transistors being used for27May
The guide to effective NAND patent investigation
With waveform and protocol testing essential to investigating memory technology patents for evidence of use, TechInsights’ Martin Bijman and Neil MacLeod take a closer look at the portfolios of the top NAND patent owners to determine how different21May
Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside. As first published in Semiconductor Digest.08May
SiC Power Transistor Process Flow Analysis: The Rohm SCT3022ALGC11 Process Flow
Contributed Author: Sinjin Dixon-Warren The market for Silicon Carbide (SiC) power transistors is expected to grow considerably over the coming years. SiC power transistors have several advantages over traditional silicon-based devices, including05May
Patent Portfolio Management: Effective Strategies and Best Practices in 2020
April 29 - 12:00-1:30 pm (ET) – Live webinar, "Patent Portfolio Management: Effective Strategies and Best Practices in 2020", hosted by The Knowledge Group. Key topics include: Patent Portfolio Management Trends and Developments, The Essentials of an29Apr
Choosing the right patent software for better results
There have never been so many IP tools and technology aides on the market, but how do you decide which ones are going to help your business? Martin Bijman of TechInsights explains.29Apr
Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services
The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to27Apr
Looking at the Apple A12Z Bionic System on Chip
Is the Apple A12Z bionic SoC just the A12X renamed, with an enabled GPU core? When we first got the Apple iPad Pro 2020 A2068 in our labs, this was the first thing we wanted to know. What is the A12Z? When we saw the A12Z, there was visually no15Apr
TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990
Last year, Samsung announced the introduction of EUV into their 7LPP process used in the Exynos 9825. Through analysis of the part, we found little difference between their 7LPP process in the 9825 and their 8LPP process in the Exynos 9820. Now, we18Mar
Recent Analysis of Samsung’s Mobile RF Components
Shannon 5800 55M5800A01 As the industry expands its use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors03Mar
If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
Apple Inc’s surprise warning that it will likely fall short of this quarter’s sales target due to the coronavirus epidemic points to much pain for its chip and other suppliers as well as for rivals who also rely on China to build their products.18Feb
Recent MediaTek Mobile RF Components and Analysis
MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing15Jan
In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
How many layers can 3D flash memory stack? Just as skyscrapers cannot be piled up indefinitely, the number of layers of 3D flash memory is also limited.08Jan
Securing Smart Connected Homes with OTP NVM
The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly06Jan
PC technology trends 2020-DRAM and Flash
新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。04Jan
Apple Is About to Add a Third OLED Supplier
This deal has been years in the making. China's BOE Technology Group has been angling to supply Apple with OLED displays destined for iPhones since early 2017.31Dec
Huawei Mate 30 Pro 5G dismantling: sell 6399 yuan complete machine, BOM cost is only 2799 yuan
According to agency analysis, the 4G version is Huawei's first smartphone product without US parts, while the 5G version still uses some American-made components, the proportion is ...30Dec
Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan
From the BOM table, the estimated price of the whole machine is $ 395.71, equivalent to less than 2800 yuan, of which the main control chip accounts for about 51.9% of the whole machine price.26Dec
What’s Next For High Bandwidth Memory
Different approaches for breaking down the memory wall.17Dec
Seoul Semiconductor patent auction analysis reveals a mixed bag of assets
Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.12Dec
Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process
集微网消息（文/Yuna），据Impress Watch网站报道，东芝在12月8日 召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。12Dec
Developing a successful licensing program
As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.25Nov
DRAM Scaling Challenges Grow
More nodes and alternative memories are in the works, but schedules remain murky.21Nov
Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
TechInsights released a digest report titled “Intel Core i7-1065G7“ Ice Lake ”10 nm 2nd Gen Processor Analysis” on October 31st .18Nov
Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors
Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.12Nov
TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
Date: November 6, 2019 / 3:00pm to 4:00pm ET Presented By: Neil MacLeod and Marty Bijman Internal Probing, Waveform Analysis, and More The widespread adoption and expansion of data centers has driven the SSD market to a period of high competition and06Nov
Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis
Intel has released their first 10 nm 2nd Gen processor into consumer products – the Intel Core i7-1065G7 processor, better known as Ice Lake. Dell and Microsoft have already announced the inclusion of Ice Lake in some of their latest offerings. This31Oct
The Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated
TechInsights has now officially released a die shot of the new Apple A13, and we can confirm a few assumptions on our side.27Oct
TechInsights: iPhone 11 Pro Max Cameras Cost $73.5
TechInsights publishes its estimation of Apple iPhone 11 Pro Max components. The cameras appear to be the post expensive part at $73.50.09Oct
How e-mobility is changing the Automotive
With some TechInsights industry experts, Morahari Reddy and Jianchun Xu, we will analyze the market and focus on different aspects.07Oct
E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars
At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lake processor.07Oct
SK hynix 96L 3D PUC NAND Analysis
Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC27Sep
TechInsights Analyses iPhone 11 Cameras
TechInsights publishes a teardown report of the new Apple iPhone 11 Pro Max smartphone with some info on its cameras:26Sep
Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.26Sep
Patent licensing: The patent battleplan
Successful, high-return patent licensing programmes require planning. Peter Hanschke of TechInsights offers a guide to getting it right.23Sep
Webinar: Preparing to License: Using tools to Scale Your Licensing Program
Originally Presented: September 19, 2019 / 12:00pm to 1:00pm ET Hosted By: Martin Bijman Licensing is a tried and true means to monetize a patent portfolio, but those who will succeed on the path from patent ownership to patent profits will not19Sep
Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
Posted: September 17, 2019 With 2018 revenue of $30.4B USD, 16.5% market share in NAND Flash Memory, and 23% market share in DRAM, Micron is one of the biggest players in storage and memory technology. For those looking to support their product17Sep
How Graphical Solutions Improve 3D NAND Effective Device Density
Driven by Moore's Law, memory and logic chip semiconductor manufacturers reduce product cost and improve performance by increasing transistor density.16Sep
Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis
Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for more10Sep
Lithium, the white gold of technology
The price of the mineral collapses, but the batteries continue to consume this white king.10Sep
Mobile manufacturing: How much do companies earn with the high end?
High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.08Sep
Peloton IPO Preview: All Hype, No Muscle
Peloton, which manufactures and sells premium, large-screen, stationary fitness bikes and treadmills, as well streaming subscriptions for classes aimed at those using the equipment, is expected to go public sometime in the next few months.03Sep
Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las02Sep
A high-end mobile phone sells almost three times what it costs to manufacture it
A mobile phone is sold almost three times more expensive than it costs to manufacture it, taking into account the cost of all the components that make up these devices, from the battery or camera to the operating system that allows applications to02Sep
Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.31Aug
Why I keep writing ’bout holes in the sensor
DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modules31Aug
Deca Technologies Fan-In WLP in Qualcomm PM8150
Posted: August 29, 2019 The fan-In WLP market expected to grow at a steady rate; from $2.9B in 2018 to $4.4B by 2024, at 6.5% CAGR. One of the recent contributors to this market is Deca Technologies, whose M-Series fan-out wafer-level packaging29Aug
Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive22Jul
AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.16Jul
Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 201910Jun
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was05Jun
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges31May
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
