Qualcomm Snapdragon 835 Application Processor MSM8998 Digital Functional Analysis

Product Code
FAR-1704-803
Release Date
29/06/2017
Availability
Published
Product Item Code
QUA-MSM8998_102
Device Manufacturer
Qualcomm
Device Type
Applications Processor
Subscription
Logic
Channel
Logic - Digital Floorplan
Report Code
FAR-1704-803
This report presents a Digital Functional Analysis of the Qualcomm HG11-P5219-1 die found inside the Qualcomm MSM8998 Snapdragon 835 PoP component. This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/STI, gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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