This report presents a Digital Floorplan Analysis of the Qualcomm HG11-PP133-200 die found inside the Qualcomm SM8350 Snapdragon 888 application processor. The SM8350 was extracted from the Xiaomi Mi 11, model NOH-AN00.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at levels including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in the CircuitVision software
• Cost of die based on the manufacturing cost analysis of the observed process