Intel i7-1065G7 (formerly Ice Lake) Intel 2nd Generation 10 nm FinFET Process Digital Floorplan Analysis

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Product Code
DFR-1908-801
Release Date
16/10/2019
Availability
Published
Product Item Code
INT-SRG0N
Device Manufacturer
Intel
Device Type
Microprocessor
Subscription
Logic
Channel
Logic - Digital Floorplan
Report Code
DFR-1908-801
This report presents a Digital Functional Analysis of the die with the markings ICL, found inside the Intel i7-1065G7 Ice Lake laptop processor.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the CircuitVision Software
  • Cost of die, based on the manufacturing cost analysis of the observed process
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