Broadcom BCM56980 StrataXGS Tomahawk 3 TSMC 16FFC FinFET Process Digital Floorplan Analysis

Product Code

DFR-1907-803

Release Date

30/08/2019

Availability

Published

Product Item Code

BRO-BCM56980B0KFSBG

Device Manufacturer

Broadcom

Device Type

Ethernet Switch

Subscription

Logic

Channel

Logic - Digital Floorplan (IP)

Logic - Digital Floorplan

Broadcom BCM56980 StrataXGS Tomahawk 3 TSMC 16FFC FinFET Process Digital Floorplan Analysis

This report presents a Digital Floorplan Analysis of the BCM56980 die found inside the Broadcom BCM56980B0KFSBG component.

This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/STI, gate, contacts, and minimum pitch metals
Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
Plan-view optical micrograph of the die delayered to the metal gate level
Identification of major functional blocks on a gate level die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and gate level die photographs delivered in the CircuitVision Software
Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

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