The Advanced Memory Essentials (AME) deliverable embedded eNOR flash comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:

• Downstream product teardown
• Package X-rays, top metal and polysilicon die photographs, non-invasive optical photographs of die features
• SEM bevel through the flash memory array and periphery logic
• SEM cross section of the general device structure, flash memory along bit lines
• Four TEM cross sections, HV transistors, logic transistors, flash memory along bit lines, metals/ILD stack
  

The results of TEM-EDS analyses are included in the AME summary document. The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.