Availability
Published
Product Code
ACE-1609-801
Product Item Code
APP-APL1W24
Device Manufacturer
Apple
Device Type
Applications Processor
Subscription
Packaging
Channel
Advanced Packaging - Process
Apple A10 APL1W24 TSMC InFO (Integrated Fan-Out) Wafer Level Package-on-Package ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
Downstream product teardown
Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
Downstream product teardown
Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features.
Optical planar images
Optical Cross Section Images
SEM Cross-Section Images
The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors
The Authoritative Information Platform to the Semiconductor Industry.
