Availability
Published
Product Code
ACE-1602-801
Release Date
Product Item Code
AMD-215-0862040
Device Manufacturer
AMD
Device Type
Graphics Processor
Subscription
Packaging
Channel
Advanced Packaging - Process
AMD Radeon R9 Fury X ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Downstream product teardown
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic region and SRAM
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • Two TEM cross sections, orthogonal to the transistor gate fingers and fins, showing the lower metals and dielectrics, transistor gates (NMOS and PMOS), fins, isolation, and other FEOL features

  • The results of TEM-EDS analyses are included in the ACE summary document. The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors
     

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