Qualcomm QPM7375A-001 MHB L-PAMiD Exploratory Analysis

Qualcomm QPM7375A-001 MHB L-PAMiD Exploratory Analysis, a multi-die module packaged in a 56-pin LGA.

The Qualcomm QPM7375A Mid/High Band (MHB) Power Amplifier Module with Low Noise Amplifier and embedded duplexers (L-PAMiD) is a multi-die module packaged in a 56-pin LGA (Land Grid Array) that measures 7.42mm x 6.21mm x 0.73mm. It contains six active dies (2 PAs, 1 LNA, 3 RF Switches, and 1 RFFE Controller) and five Surface Acoustic Wave (SAW) filter dies. The QPM7375A used in this analysis was taken from the Xiaomi 17 Pro Max (2509FPN0BC) smartphone from China.