Samsung S5541 FR1 RF Transceiver Packaging Analysis

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This is a package analysis report of the Samsung S5M5541 die found inside the Samsung S5541 component. The S5541 component was extracted from the Galaxy Z Flip7 (SM-F766W) foldable smartphone. The information contained in this report is relevant to:

• RF and IP core for WiFi / IoT designers: Understand and compare between foundries how a given mixed digital / analogue RF design translates into a fabricated die.
• Foundries: Compare, calibrate, and troubleshoot mixed digital and RF technologies and processes for IoT connectivity applications.
• Downstream Markets (IoT OEMs and Application Developers): Compare chip design trends and architectures used by their competitors and understand their advantages and shortcomings.