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Latest Blogs and Commentary
Supersizing AI: The Changing Role of Advanced Packaging
AI architectures are diversifying as inference, memory innovation, and new integration approaches change packaging requirements. TechInsights examines what these shifts could mean for advanced packaging suppliers.
2027 Outlook Webinar Series: AI, Packaging, Manufacturing & Sustainability
Register for three 2027 outlook webinars. Get the free Five Trends report now, plus every 2027 Outlook report as it publishes in the TechInsights Platform.
The Chip Insider®–Data Center water scare
Inside G. Dan Hutcheson’s latest analysis, the data center water debate takes an unexpected turn as he reveals why traditional cloud data centers and newer AI data centers have vastly different water demands and why AI may not be the water problem many believe it to be.
Why Semiconductor Emissions are Outpacing Silicon Shipments
Semiconductor emissions are forecast to grow faster than silicon shipments through 2031. See how process nodes, electricity, and fab locations shape the outlook.
How Software Efficiency Can Help Offset Rising Memory Costs
As DRAM and NAND prices rise, software efficiency is becoming increasingly relevant to hardware decisions. Explore the strategies emerging across major ecosystems.
Key Cloud and Digital Services Revenue to Exceed $5 Trillion in 2031
AI-driven demand is pushing cloud and digital services beyond previous growth expectations. TechInsights forecasts the worldwide market will exceed $5 trillion in annual revenue by 2031, led by continued growth across cloud computing, SaaS, social media, and search.
The Chip Insider®– State of the Semiconductor Union
Inside G. Dan Hutcheson’s latest analysis, the seven layers of the Semiconductor Demand Stack reveal an industry at remarkable highs, as AI demand, semiconductor growth, economic conditions, and geopolitical risks shape the outlook for the cycle ahead.
The Hidden Complexity of the Power GaN Manufacturing Ecosystem Revealed by Technical Analyses
Whose GaN is it anyway? TechInsights brings together technical analyses to examine the die-supplier relationships behind devices from leading power GaN manufacturers.
The Chip Insider®– Strategic implications of ASML’s 12-inch EUV reticle and the TSMC-Intel War
Inside G. Dan Hutcheson’s latest analysis: Intel is moving early on High-NA EUV while TSMC holds back, the next technology cycle raises a familiar question: How much could lithography influence the competitive race?
How Software-Defined Vehicles Are Reshaping the Automotive Value Chain
The automotive software market is reshaping the value chain. See what changing architectures and demand mean for semiconductor suppliers through 2033.
What Teardown Data Actually Confirms About New Technology Adoption
Learn how teardown data from 15,000+ devices confirms which sensor and display technologies are moving from roadmaps into shipping products.
The Chip Insider®– Memories: How Korea and SK hynix rose to dominance in HBM
Inside G. Dan Hutcheson’s latest analysis, the rise of HBM reveals how SK hynix and Korea transformed memory from a commodity business into a strategic AI enabler, reshaping competition and industry economics.
Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor
TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture.
iPhone 18 Pro Max Unboxing and First Look
Watch TechInsights unbox the Apple iPhone 18 Pro Max before our experts begin detailed teardown and semiconductor analysis.
Apple iPhone 18 Pro Max Teardown: A20 Pro, X80 and Apple N1
See what TechInsights’ preliminary teardown reveals about the iPhone 18 Pro Max, including its A20 Pro processor, Qualcomm X80 modem, Apple N1, and new mmWave hardware.
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