Embedded & Emerging Memory Competitive Insights to Inform your Business Strategy
As the industry has been developing several next generation memory types, technologists are driven to accelerate development and optimize process steps on new device releases. The TechInsights Embedded and Emerging Memory Subscription provides companies with competitive analysis revealing the process design innovations of today’s technology market leaders. Combined with our 30+ years of expertise as well as extensive breadth of analysis and technology, a TechInsights subscription can help inform business strategy by delivering curated, competitive insight on cutting edge technical innovation.
Available Embedded & Emerging Memory Subscriptions
TechInsights Memory offerings have been developed to provide the focused technical intelligence you need based on your industry and role.
Floorplan Analysis (MFR)
Focused on embedded and emerging memory, provides a high level view of design quality by providing insight into memory area efficiency, the technology node for process generation, and memory capacity per die through functional analysis and benchmarking.
- Executive summary supported with image sets
- Process Node and Foundry Identification
- Critical Dimensions
- Functional Block Summary
- Stacked optical top metal and poly die photo delivered in CircuitVisionTM
- SEM bevel
- SEM cross-sectional imaging
- 4 reports/year
Process Analysis
Focused on enabling understanding of all process aspects of embedded and emerging memory through dimensional, materials, architecture analysis. Also provides analyst perspective on the above to provide insight into trends and roadmap.
- Executive summary supported by large image sets
- SEM cross-sectional and bevel imaging
- TEM cross-sectional with TEM EDS
- Technical trend/roadmap by technology element
- Design technology interaction analysis
- Detailed explanation of process integrations
- Next node predictions
- 4 reports/year
- Trend Analysis - 1 briefing / year
- 1 Annual Seminar
- Forecasting
- Q&A
Process Flow Analysis
Provides insight into the manufacturing process steps, materials, and technology across leading edge embedded and emerging memory chips. Requires a subscription to the Embedded & Emerging Process channel.
Process Flow Analysis
- Spreadsheets showing process architecture, mask list, and integration-level process steps
- 4/year
Process Flow Full Emulation
- Layout GDS fully decomposed into process layers
- Synopsys Process Explorer PDF output reports
- Synopsys Input (Route-Level Deck)*
- 4/year
*Requires Synopsys license to view and modify
Analyst Expertise
- Cell Design technology interaction analysis
- Detailed explanation of process integration from wafer-in through wafer-out
- Process steps, materials, equipment type, unit process
- SEM and TEM cross-sectional and top-view images
- Layer annotations, specific process module, assumption
- 4 hours support on questions related to the above
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| Related Analysis | Manufacturer | Analysis Type | Subscription Channel |
|---|---|---|---|
| Analyst Briefing: Emerging & Embedded Memory - Process - 2020 12 | Process | Memory - Embedded & Emerging Process | |
| Avalanche Technology pMTJ STT-MRAM Process Flow Full | Renesas | Process | Memory - Embedded & Emerging Process Flow |
| Samsung 28 nm FDS eMRAM Process Flow Full | Sony | Process | Memory - Embedded & Emerging Process Flow |
| Samsung 28 nm FDS eMRAM Process Flow Analysis | Sony | Process | Memory - Embedded & Emerging Process Flow |
| Everspin 1Gb 28 nm pMTJ STT-MRAM Memory Floorplan Analysis | Everspin Technologies | Floorplan | Memory - Embedded & Emerging Floorplan Analysis |
| Everspin 1Gb 28 nm pMTJ STT-MRAM Advanced Memory Essentials | Everspin Technologies | Process | Memory - Embedded & Emerging Process |
| Fujitsu 8 Mb 45 nm ReRAM MB85AS8MT Memory Floorplan Analysis | Fujitsu | Floorplan | Memory - Embedded & Emerging Floorplan Analysis |
| Fujitsu 8 Mb 45 nm ReRAM MB85AS8MT Advanced Memory Essentials | Fujitsu | Process | Memory - Embedded & Emerging Process |
| Fujitsu 8 Mb 45 nm ReRAM MB85AS8MT Process Flow Analysis | Fujitsu | Process | Memory - Embedded & Emerging Process Flow |
| Fujitsu 8 Mb 45 nm ReRAM MB85AS8MT Process Flow Full | Fujitsu | Process | Memory - Embedded & Emerging Process Flow |
Recent News and Blogs
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World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin
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TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis
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KIOXIA’s new XL-FLASH for ultra-low latency NAND application
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Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies
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A New and advanced ReRAM from Fujitsu
March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The11Mar
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DRAM Scaling Challenges Grow
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Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
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TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
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E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars
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SK hynix 96L 3D PUC NAND Analysis
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TechInsights Analyses iPhone 11 Cameras
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Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
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Patent licensing: The patent battleplan
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Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
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How Graphical Solutions Improve 3D NAND Effective Device Density
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Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis
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Lithium, the white gold of technology
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Mobile manufacturing: How much do companies earn with the high end?
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Peloton IPO Preview: All Hype, No Muscle
Peloton, which manufactures and sells premium, large-screen, stationary fitness bikes and treadmills, as well streaming subscriptions for classes aimed at those using the equipment, is expected to go public sometime in the next few months.03Sep
Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las02Sep
A high-end mobile phone sells almost three times what it costs to manufacture it
A mobile phone is sold almost three times more expensive than it costs to manufacture it, taking into account the cost of all the components that make up these devices, from the battery or camera to the operating system that allows applications to02Sep
Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.31Aug
Why I keep writing ’bout holes in the sensor
DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modules31Aug
Deca Technologies Fan-In WLP in Qualcomm PM8150
Posted: August 29, 2019 The fan-In WLP market expected to grow at a steady rate; from $2.9B in 2018 to $4.4B by 2024, at 6.5% CAGR. One of the recent contributors to this market is Deca Technologies, whose M-Series fan-out wafer-level packaging29Aug
Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive22Jul
AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.16Jul
Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 201910Jun
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was05Jun
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges31May
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
