Product Code
DFR-2005-802
Availability
Published
Product Item Code
PIA-SGC67120
Device Manufacturer
Pixelworks
Subscription
Logic
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Pixelworks Iris 5 TSMC 22ULP Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the SGC67120 die found inside Pixelworks PX8578 package. ThePX8578 package was torn down from the OPPO Find 2X (model CPH2023) GSM multi-band handset.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including shallow trench isolation (STI), gate, contacts, and minimum pitch metals
- Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
- Plan-view optical micrograph of the die delayered to the metal gate level
- Identification of major functional blocks on a gate level die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and gate level die photographs delivered in the CircuitVision software
- Cost of die, based on the manufacturing cost analysis of the observed process
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