This report presents a Memory Functional Analysis of the SK Hynix H25FT4MA0 die found inside the SK Hynix H23Q4T80K6MES-BC package.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of a bevel through the memory array showing the active, bit and word line level plan-view features of the memory array and a cross-section through the bit line, showing the general structure of the flash cell array, die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on the polysilicon layer die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and diffusion level die photographs delivered in the CircuitVision software