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DRAM Functional Analysis (MFR)
Includes:
- Executive summary supported with image sets
- Process node and foundry identification
- Critical dimensions
- Functional block summary
- Stacked optical top metal and poly die photo delivered in CircuitVision. Includes calibrated measurement and annotations tools
- SEM cross-sectional and bevel imaging
- 13-15 reports/year
DRAM: SWD and Sense Amp Transistor Characterization
Includes:
- Transitor Characterization Report (TCR)
- Universal curves for IOFF vs. ION and IOFF vs. ID, LIN derived from
- 5 NMOS and 5 PMOS sub wordline driver transistors, across multiple VDD at 85°C
- 5 NMOS and 5 PMOS sense amp transitors, across multiple VDD at 85°C
- For each universal curve data point
- Transistor Characteristics: ID, SAT, ID, Lin, Ioff, VT, Lin & VT, SAT, ΔVGS, Gm, SS, DIBL
- Output Characteristics
- Universal curves for IOFF vs. ION and IOFF vs. ID, LIN derived from
- Analysis Coverage
- 4 reports/year
- Trend Analysis
- 4 hrs support
DRAM Periphery Design (MDP): Sense Amp, Sub Wordline Driver
Includes:
- Concise analyst's summary of critical device metrics
- Circuit schematic diagram of sense amplifier
- Circuit schematic diagram of a sub wordline driver
- Detailed stacked SEM images of a delayered DRAM sense amplifier and sub wordline driver delivered in CircuitVision. Includes calibrated measurement and annotation tools
- ~4 reports/year
DRAM: Circuit Analysis
Includes:
- Full Circuit Analysis
- 1 - Memory Array and Peripherals
- 2 - Address Path
- 3 - Data Path
- 4 - Control Blocks, Configuration and Test Block
- 5 - Voltage Generators System
- Analysis Coverage
- Full 2/year
NAND Functional Analysis
Includes:
- Analysis Coverage
- Executive summary supported with image sets
- Process Node and Foundry Identification
- Critical Dimensions
- Functional Block Summary
- Stacked optical top metal and poly die photo delivered in CircutVision which includes calibrated measurement tools
- SEM cross-sectional imaging
- 13-15 reports/year
- Executive summary supported with image sets
NAND Periphery Design (MDP): Page Buffer, Wordline Driver
Includes:
- Concise analyst's summary of critical device metrics
- Circuit schematic diagram of a page buffer: decoder, switch, and controller
- Circuit schematic diagram of a wordline driver: decoder and switch
- Detailed stacked plan view SEM images of a beveled NAND page buffer and wordline driver delivered in CircuitVision. CircuitVision includes calibrated measurement and annotation tools
- ~4 reports/year
NAND: Circuit Analysis
Includes:
- Full Circuit Analysis
- 1 - Memory Array and Peripherals
- 2 - Address Path
- 3 - Data Path
- 4 - Control Blocks, Configuration and Test Block
- 5 - Voltage Generators System
- Analysis Coverage
- Full 2/year
NAND Internal Waveform Analysis
This channel examines the waveforms used on NAND memory cells during program, read and erase cycles.
- Delivers 8 reports over a 12-month period as well as an online seminar
- Provides a Waveform summary PDF and raw waveform .sht files to enable the customer to perform further analysis and measurements
Advanced Process
Includes:
- Advanced Memory Essentials (AME)
- Focused on leading edge NAND and DRAM memory technology
- Executive summary supported by large image sets
- SEM cross-sectional and bevel imaging
- TEM cross-sectional analysis with TEM EDS
- 8 reports/year
- Analysis Coverage
- Technical trend/roadmap by technology element
- Design technology interaction analysis
- Detailed explanation of process integrations
- Next node predictions
- 3 briefings/year
- Trend analysis
- Forecasting
- 1 annual seminar
- 4 hrs support
Process Flows
*Requires Advanced Process Subscription
Includes:
- Process Flow Analysis (PFA)
- Spreadsheets showing process, architecture, mask list, and integration-level process steps
- 8 Memory / year
- Process Flow Full Emulation (PFF)
- PFA content may be updated
- Layout GDS fully decomposed into process layers
- 3D Emulation
- Synopsys Input (Route-Level Deck)*
*Requires Synopsys license to view and modify - 6 Memory / year
- Analysis Coverage
- Cell Design technology interaction analysis
- Detailed explanation of process integration from wafer-in through wafer-out
- Process steps, materials, equipment type, unit process
- SEM and TEM cross-sectional and top-view images
- Layer annotations, specific process module, assumption
- Trend analysis
- +4 hrs support
Embedded & Emerging Functional Analysis (MFR)
Includes:
- Analysis Coverage
- Focused on leading-edge embedded and emerging memory technology
- Executive summary supported with image sets
- Process Node and Foundry Identification
- Critical Dimensions
- Functional Block Summary
- Stacked optical top metal and poly die photo delivered in CircuitVisionTM
- SEM bevel
- SEM cross-sectional imaging
- 4 reports/year
Embedded & Emerging Process Analysis
Includes:
- Analysis Coverage
- Focused on leading-edge embedded and emerging memory
- Executive summary supported by large image sets
- SEM cross-sectional and bevel imaging
- TEM cross-sectional with TEM EDS
- Technical trend/roadmap by technology element
- Design technology interaction analysis
- Detailed explanation of process integrations
- Next node predictions
- 4 reports/year
- Trend Analysis - 1 briefing / year
- Forecasting
- Q&A
TechInsights Platform
A TechInsights subscription gives you the data you need - instantly.
Search our analysis and website
| Related Analysis | Manufacturer | Analysis Type | Subscription Channel |
|---|---|---|---|
| CircuitVision Analysis (Full) on the Samsung K4A8G085WD-BCTD 1Y DDR4 DRAM (with Cadence Files) | Samsung | Circuit | Memory - DRAM Circuit Analysis |
| Samsung 1y 12 Gb LPDDR4X Memory Floorplan Analysis | Samsung | Floorplan | Memory - DRAM Floorplan Analysis |
| Micron D1z 16 Gb LPDDR4 Memory Floorplan Analysis | Micron Technology | Floorplan | Memory - DRAM Floorplan Analysis |
| Nanya 20nm DDR4 4Gb D-Die Memory Floorplan Analysis | Nanya Technology Corporation | Floorplan | Memory - DRAM Floorplan Analysis |
| Micron 1y GDDR6X Memory Floorplan Analysis | Micron Technology | Floorplan | Memory - DRAM Floorplan Analysis |
| Samsung 128L NAND die (K9AFGD8U0C) Advanced Memory Essentials | Samsung | Process | Memory - Process |
| Samsung 128L NAND die (K9AFGD8U0C) Memory Peripheral Design | Samsung | Circuit | Memory - NAND Peripheral Design |
| Samsung 128L NAND die (K9AFGD8U0C) Process Flow Analysis | Samsung | Circuit | Memory - Process Flow Analysis |
| Samsung 128L NAND die (K9AFGD8U0C) Process Flow Full | Samsung | Process | Memory - Process Flow Analysis |
| Samsung K9AFGD8U0C 128L NAND die Memory Floorplan Analysis | Samsung | Floorplan | Memory - NAND Floorplan Analysis |
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Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
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Apple iPhone 11 Pro Max Teardown
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Patent licensing: The patent battleplan
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Originally Presented: September 19, 2019 / 12:00pm to 1:00pm ET Hosted By: Martin Bijman Licensing is a tried and true means to monetize a patent portfolio, but those who will succeed on the path from patent ownership to patent profits will not19Sep
Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
Posted: September 17, 2019 With 2018 revenue of $30.4B USD, 16.5% market share in NAND Flash Memory, and 23% market share in DRAM, Micron is one of the biggest players in storage and memory technology. For those looking to support their product17Sep
How Graphical Solutions Improve 3D NAND Effective Device Density
Driven by Moore's Law, memory and logic chip semiconductor manufacturers reduce product cost and improve performance by increasing transistor density.16Sep
Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis
Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for more10Sep
Lithium, the white gold of technology
The price of the mineral collapses, but the batteries continue to consume this white king.10Sep
Mobile manufacturing: How much do companies earn with the high end?
High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.08Sep
Peloton IPO Preview: All Hype, No Muscle
Peloton, which manufactures and sells premium, large-screen, stationary fitness bikes and treadmills, as well streaming subscriptions for classes aimed at those using the equipment, is expected to go public sometime in the next few months.03Sep
Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las02Sep
A high-end mobile phone sells almost three times what it costs to manufacture it
A mobile phone is sold almost three times more expensive than it costs to manufacture it, taking into account the cost of all the components that make up these devices, from the battery or camera to the operating system that allows applications to02Sep
Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.31Aug
Why I keep writing ’bout holes in the sensor
DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modules31Aug
Deca Technologies Fan-In WLP in Qualcomm PM8150
Posted: August 29, 2019 The fan-In WLP market expected to grow at a steady rate; from $2.9B in 2018 to $4.4B by 2024, at 6.5% CAGR. One of the recent contributors to this market is Deca Technologies, whose M-Series fan-out wafer-level packaging29Aug
GaN, SiC, and Si technologies in AC Adapters
Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device14Aug
Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown
2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung02Aug
Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image30Jul
Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the23Jul
Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive22Jul
Part 2: Pixel Scaling and Scaling Enablers
4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop16Jul
AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.16Jul
Part 1: Chip-stacking and chip-to-chip interconnect
4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image09Jul
Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 201910Jun
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was05Jun
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges31May
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees11Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Samsung Galaxy S10 5G Teardown
Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world09Apr
Analyzing innovations in mobile radio frequency front-end integration
Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support09Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Samsung Galaxy S10+ Teardown
Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in01Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Lenovo Brings the New Snapdragon to Market
Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell20Feb
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to07Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
Job Vacancy: VP, Financial Controller
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate11Sep
Job Vacancy: Software Developer
We are currently seeking a Full Stack Software Developer to join one of our Colorado TechInsights Platform development teams. Do you have a passion for solving complex and interesting problems? Do you strive to learn something new every day? Do you11Sep
Job Vacancy: Sales Representative
The Inside Sales Representative is a key member of the go-to-market sales team. Working in close cooperation with the outside sales and Marketing teams, you will be responsible for following up on leads while identifying new business or sales10Sep
Job Vacancy: VP, Sales Operations
Thanks to our growth, we are now recruiting an individual to lead our Sales Operations functions and further evolve the business via the support of our corporate goals and objectives, including, but not limited to: reporting, analysis, business09Sep