NVIDIA GB10 Superchip (from DGX Spark) Floorplan Analysis

NVIDIA’s DGX Spark teardown reveals a TSMC 3nm GB10 GPU package, with analysis covering node ID, layout, dimensions, and manufacturing cost.

The NVIDIA DSE1-275-A1 package was removed from the NVIDIA GB10 processor of the NVIDIA DGX Spark P4242 Desktop Computer. The NVIDIA DGX Spark is a compact AI-powered personal desktop workstation developed by NVIDIA and introduced in October 2025 to perform AI tasks locally without accessing data center servers. It is powered by the NVIDIA GB10 Grace Blackwell Superchip processor. The NVIDIA DSE1-275-A1 package contains the T254G-A01 GPU die with "NVIDIA [M]2024 (c) T254G-A01" die markings.

According to the present and previous analyses conducted by TechInsights, the GPU die is manufactured by TSMC using its 3 nm (N3E) process technology. This analysis includes node identification, BELO stack, bit cell usage, critical dimensions, and digital blocks layout with die utilization calculations for total area for logic, I/O memory, and analog components separately. Manufacturing cost is also provided