Samsung S3JU100 28 nm 4 Mb eFlash Memory Floorplan Analysis

The report details a Memory Floorplan Analysis of the Samsung Exynos Connect U100 ultra-wideband chip, highlighting its capabilities for precise indoor tracking.

This report presents a Memory Floorplan Analysis (MFR) of the Samsung S3JU100 die found inside Samsung Exynos Connect U100 ultra-wideband (UWB) system-on-chip (SoC) U100A01 package. The U100A01 was extracted from the Google Pixel 10 Pro GEHN3, obtained on August 27, 2025. The Samsung Exynos Connect U100 UWB SoC U100A01 package is a 109-pin wafer-level chip-scale package (WLCSP) with one die within. The U100 integrates radio frequency (RF), baseband, embedded flash (eFlash) memory, and power management IP into a single chip. It provides an accuracy of single-digit centimeters and under five degrees, helpful in tracking location in challenging indoor environments when the global positioning system (GPS) network is unavailable, as well as for augmented reality (AR) and virtual reality (VR) applications that require precise and real-time tracking of moving people.