AMD Ryzen 9 7950X3D Advanced Packaging Process Flow Analysis

Dive into TSMC’s SoIC 3D integration with our analysis of the hybrid-bonded SoIC-X process in AMD’s 7950X3D, outlining key packaging steps and critical dimensions.

TSMC's system on integrated chips (SoIC) technology platform is the company's path to 3D heterogeneous integration. Hybrid bonded SoIC-X using a chip on wafer (CoW) face-to-back (F2B) configuration was first to market. This report provides a packaging process flow analysis (PFA) of that technology, based on AMD’s 7950X3D, one of that company’s popular desktop gaming processors featuring a vertical L3 cache expansion chiplet (V-Cache). The report provides detailed processing steps and critical dimensions from plasma-based wafer dicing to final package assembly.