5 Expectations for the Advanced Packaging Market in 2026
AI, 3D stacking, and next-gen substrates—what’s next for advanced packaging.
The advanced packaging industry is at the forefront of semiconductor innovation, driven by explosive AI growth and ever-more complex chip architectures. Companies are navigating transitions from wafer-scale processing to panel and glass substrates, integrating optics with electronics, and solving new thermal and power-density challenges for 3D stacked packages. This live TechInsights webinar highlights the five developments every strategist, designer, and executive needs to understand to lead in 2026.
What You’ll Learn:
In this session we’ll unpack five high-impact topics and their strategic implications:
Co-Packaged Optics Go Mainstream — how integrating optics with electronics is redefining high-speed datacenter interconnects.
AI’s Appetite for HBM — scaling high-bandwidth memory to meet AI accelerator demands.
Scaling Up for Panels and Glass — the transition from wafer to panel-scale substrates for next-gen packages.
Turning Up the Heat in 3D — advanced thermal management for increasingly complex 3D stacked packages.
A Mobile Reconfiguration: Chiplets in the Smartphone? — exploring chiplet integration for smaller, high-performance mobile devices.
Strategists, packaging and IC designers, foundry and substrate managers, supply-chain leaders, and executives who need actionable insight into how packaging trends will change product roadmaps, manufacturing choices, and cost/performance tradeoffs.
Meet the presenters
Adrienne Downey
Senior Market Research Analyst
Adrienne Downey is a Market Research Analyst with over 25 years of semiconductor industry experience. At TechInsights, she specializes in advanced packaging techniques, including chiplets, wafer-level packaging, and 2.5D/3D stacking technologies that enable higher performance, lower power devices. She leverages data-driven insights to help clients solve complex packaging challenges.
Cameron McKnight-MacNeil
Process Analyst
Cameron McKnight-MacNeil is a Process Analyst with over a decade of experience analyzing semiconductor advanced packaging technologies. He regularly analyzes high-performance compute, AI, desktop, and mobile devices, documenting how they're made and what makes them unique. Cameron holds numerous patents in advanced packaging and compound semiconductors.
Once you’ve watched the 5 Expectations... what’s next?
That’s where TechInsights comes in. The Advanced Packaging Outlook Report helps you turn the webinar’s signals — AI-driven HBM demand, 3D stacking thermal and power challenges, wafer→panel transitions, co-packaged optics, and evolving substrate technology — into an actionable roadmap. We break down technical advances across substrates and interposers, 3D integration and TSV alternatives, thermal and power solutions, OSAT/foundry strategies, and supply-chain implications—giving you the clarity needed to prioritize investments, de-risk sourcing decisions, and accelerate product innovation.
Already a subscriber? Log in to access the complete Outlook Report series—including the full Advanced Packaging Report — and connect with your account manager to discuss how emerging packaging technologies and supply-chain shifts will affect your product and platform roadmaps.
Ready to elevate your competitive advantage? View the full 2026 Advanced Packaging Outlook Report for exclusive insights, deep technical analysis, and strategic guidance to help you design higher-performance, more manufacturable, and thermally robust semiconductor packages for the next era of compute and AI acceleration.
Don’t just react to the market—lead it.
This webinar gives you the context and technical/market signals needed to adapt roadmaps, prioritize investments, and influence architecture choices for AI, datacenter, mobile, and edge products.
Originally aired: December 2, 2025
