Bestechnic BES2300 Bluetooth 5.0 Audio Chip Basic Floorplan Analysis

Product Code
BFR-1907-801
Release Date
06/09/2019
Availability
Published
Product Item Code
BHC-BES2300
Device Manufacturer
Bestechnic
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Floorplan Analysis
Report Code
BFR-1907-801
This report presents a Basic Floorplan Analysis of the Bestechnic BT1300 and BT1800A02 dies found inside the Bestechnic BES2300 component.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.

Don't miss another update from TechInsights.

All our latest content updates sent to you a few times a month.