Product Code
BFR-1901-803
Availability
Published
Product Item Code
CYP-CY8C6347BZI-BLD33
Device Manufacturer
Cypress Semiconductor
Device Type
Microcontrollers
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Floorplan Analysis
Report Code
BFR-1901-803
This report presents a Basic Floorplan Analysis of the Cypress Semiconductor 7C57100A BT 5.0 and 8C54000B 32-bit dual-core CPU with Flash memory dies found inside the Cypress Semiconductor CY8C6347BZI-BLD33 component.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon level
- Identification of major functional blocks on gate level die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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