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World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin
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TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis
March 23, 2021 Abdullah Rahal TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis TechInsights’ analysts have examined the Blackberry patent portfolio and partitioned it into a dozen application areas23Mar
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Dynamic Vision Sensors – A Brief Overview - Image Sensor TechStream Blog
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Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies
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A New and advanced ReRAM from Fujitsu
March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The11Mar
GaN USB-C Charger Market Heating Up in 2021
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Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary
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Webinar: Selected Imager and Sensor Trends and Comparisons
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LiDAR 101 – Solid-State and Mechanical LiDARs
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Webinar: Gearing Up for the Electric Vehicle (EV) Revolution
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Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market
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Samsung Galaxy S21 – rival 5 nm solutions, new design wins, and LPDDR5 with 1z EUV?
February 02, 2021 Teardown Disruptive Technology Samsung Galaxy S21 – rival 5 nm solutions, new design wins, and LPDDR5 with 1z EUV? Right from the release announcement, it seemed the Samsung Galaxy S21 flagship phone was going to be a little bit02Feb
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TechInsights Cracks Open the STMicroelectronics MasterGaN2 - Power TechStream Blog
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Supporting IP strategy in the semiconductor industry
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Sony d-ToF Sensor found in Apple’s new LiDAR camera
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Analysis of Apple M1 is Happening – and, Thermal Imaging?
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Webinar: Increasing Value of Semiconductor IP in the Automotive Supply Chain
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Two new Apple SoCs, two market events: Apple A14 and M1
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Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters
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Webinar: ALD/ALE Process in Commercially Available Memory Devices
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October Apples: Apple iPhone 12 Pro Teardown - Teardown TechStream Blog
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New GDDR6X from Micron - Memory TechStream Blog
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STMicroelectronics Displaces Sony ToF in Galaxy Note Series - Image Sensor TechStream Blog
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A New Player Emerges in the GaN Charger Market – Innoscience INN650D02 Found Inside the Rock RH-PD65W USB-C Charger
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Avalanche 40 nm pMTJ STT-MRAM - Memory TechStream Blog
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Hybrid Bonding Expands from Image Sensors to Logic, Memory - Image Sensor, Logic & Memory TechStream Blog
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Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing
Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying23Sep
DRAM, 3D NAND Face New Challenges
Semiconductor Engineering - Various memories and business outlooks are all over the map, sometimes literally, with lots of confusion ahead.21Sep
SK hynix 128L 3D PUC NAND (4D NAND)
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Inside the Intel RealSense L515 LiDAR Camera
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Webinar: ALD/ALE Process in Commercially Available Logic Devices
ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards26Aug
Samsung S5K33D i-ToF with 7 µm Pixel Global Shutter - Image Sensor TechStream Blog
Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. August 12, 2020 Our teams12Aug
60 years of the Semiconductor industry and its changing patent strategy
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A Review of the Chevy Bolt Powertrain
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Memory Process Webinar: 3D NAND Word Line Pad (WLP)
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Intel’s 10nm Node: Past, Present, and Future – Part 2
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Apple Computers: Transitioning to ARM Chips is Coming Soon
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Panasonic’s expertise in patent monetisation has never been more important
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On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN
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The guide to effective NAND patent investigation
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Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
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SiC Power Transistor Process Flow Analysis: The Rohm SCT3022ALGC11 Process Flow
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Patent Portfolio Management: Effective Strategies and Best Practices in 2020
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Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services
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Looking at the Apple A12Z Bionic System on Chip
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TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990
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Recent Analysis of Samsung’s Mobile RF Components
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If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
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Recent MediaTek Mobile RF Components and Analysis
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In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
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Securing Smart Connected Homes with OTP NVM
The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly06Jan
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Apple Is About to Add a Third OLED Supplier
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Huawei Mate 30 Pro 5G dismantling: sell 6399 yuan complete machine, BOM cost is only 2799 yuan
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Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan
From the BOM table, the estimated price of the whole machine is $ 395.71, equivalent to less than 2800 yuan, of which the main control chip accounts for about 51.9% of the whole machine price.26Dec
What’s Next For High Bandwidth Memory
Different approaches for breaking down the memory wall.17Dec
Seoul Semiconductor patent auction analysis reveals a mixed bag of assets
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Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process
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Developing a successful licensing program
As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.25Nov
DRAM Scaling Challenges Grow
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Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
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Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors
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TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
Date: November 6, 2019 / 3:00pm to 4:00pm ET Presented By: Neil MacLeod and Marty Bijman Internal Probing, Waveform Analysis, and More The widespread adoption and expansion of data centers has driven the SSD market to a period of high competition and06Nov
Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis
Intel has released their first 10 nm 2nd Gen processor into consumer products – the Intel Core i7-1065G7 processor, better known as Ice Lake. Dell and Microsoft have already announced the inclusion of Ice Lake in some of their latest offerings. This31Oct
The Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated
TechInsights has now officially released a die shot of the new Apple A13, and we can confirm a few assumptions on our side.27Oct
TechInsights: iPhone 11 Pro Max Cameras Cost $73.5
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How e-mobility is changing the Automotive
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E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars
At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lake processor.07Oct
SK hynix 96L 3D PUC NAND Analysis
Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC27Sep
TechInsights Analyses iPhone 11 Cameras
TechInsights publishes a teardown report of the new Apple iPhone 11 Pro Max smartphone with some info on its cameras:26Sep
Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.26Sep
Patent licensing: The patent battleplan
Successful, high-return patent licensing programmes require planning. Peter Hanschke of TechInsights offers a guide to getting it right.23Sep
Webinar: Preparing to License: Using tools to Scale Your Licensing Program
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Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
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How Graphical Solutions Improve 3D NAND Effective Device Density
Driven by Moore's Law, memory and logic chip semiconductor manufacturers reduce product cost and improve performance by increasing transistor density.16Sep
Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis
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Lithium, the white gold of technology
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Mobile manufacturing: How much do companies earn with the high end?
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Peloton IPO Preview: All Hype, No Muscle
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Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las02Sep
A high-end mobile phone sells almost three times what it costs to manufacture it
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Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
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Why I keep writing ’bout holes in the sensor
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Deca Technologies Fan-In WLP in Qualcomm PM8150
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Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive22Jul
AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.16Jul
Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 201910Jun
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was05Jun
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges31May
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
