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Qualcomm Snapdragon 888

Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market

February 03, 2021 Logic Disruptive Technology Download the brief Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings - the Apple A14 and the Exynos 2100. With the
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03Feb
Sony d-ToF Sensor found in Apple’s new LiDAR camera

Sony d-ToF Sensor found in Apple’s new LiDAR camera

January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry experts expect that this part will be in use for the
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19Jan
SK hynix 128L 3D PUC NAND

SK hynix 128L 3D PUC NAND (4D NAND)

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral circuits are stacked under the cell, resulting in
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14Sep
Qualcomm's Snapdragon SDR865 Transceiver

Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services

The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to deliver both 4G & 5G services dynamically." A key
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27Apr
Exynos 990

TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990

Last year, Samsung announced the introduction of EUV into their 7LPP process used in the Exynos 9825. Through analysis of the part, we found little difference between their 7LPP process in the 9825 and their 8LPP process in the Exynos 9820. Now, we are excited to say that we have found Samsung’s
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18Mar
Recent Analysis of Samsung’s Mobile RF Components

Recent Analysis of Samsung’s Mobile RF Components

Shannon 5800 55M5800A01 As the industry expands its use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors. TechInsights has compiled a briefing on Samsung’s
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03Mar
Recent MediaTek Mobile RF Components and Analysis

Recent MediaTek Mobile RF Components and Analysis

MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing, MediaTek holds 14% of the global cellular baseband
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15Jan
Intel Core i7-1065G7 “Ice Lake” 10 nm+ Processor Analysis

Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis

Intel has released their first 10 nm 2nd Gen processor into consumer products – the Intel Core i7-1065G7 processor, better known as Ice Lake. Dell and Microsoft have already announced the inclusion of Ice Lake in some of their latest offerings. This is Intel’s first processor built on what they are
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31Oct
SK hynix 96L 3D PUC NAND Analysis

SK hynix 96L 3D PUC NAND Analysis

Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC NAND flash device followed a similar approach to
Read More
27Sep
Innovation Technology: Micron

Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered

Posted: September 17, 2019 With 2018 revenue of $30.4B USD, 16.5% market share in NAND Flash Memory, and 23% market share in DRAM, Micron is one of the biggest players in storage and memory technology. For those looking to support their product development roadmap, circuit extraction, waveform
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17Sep
Deca Technologies Fan-In WLP in Qualcomm PM8150

Deca Technologies Fan-In WLP in Qualcomm PM8150

Posted: August 29, 2019 The fan-In WLP market expected to grow at a steady rate; from $2.9B in 2018 to $4.4B by 2024, at 6.5% CAGR. One of the recent contributors to this market is Deca Technologies, whose M-Series fan-out wafer-level packaging (FOWLP) technology has been adopted by Qualcomm in
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29Aug
Velodyne LiDAR Puck Teardown

Velodyne LiDAR Puck Teardown

Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive industry. LiDAR manufacturers, automotive OEMs, and
Read More
22Jul

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