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Featured Reports

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  3. 最新ニュースおよびブログ
Qualcomm QTM545 Analysis

Qualcomm QTM545 Analysis

The Samsung Galaxy S22 Ultra has the latest and greatest Qualcomm mmWave, but not in Europe...
Read More
2022Mar 9
Disruptive Technology: TSMC 22ULL eMRAM

Disruptive Technology: TSMC 22ULL eMRAM

TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm
Read More
2021Aug 26
Micron 176L 3D NAND

Micron 176L 3D NAND

NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process
Read More
2021Aug 13
Micron DDR5 DIMM Technology

Micron DDR5 DIMM Technology

DRAM Memory Technology Disruptive Product: What technology node for 1st DDR5 DIMM? DDR5 is a new generation of Memory! All the major DRAM players are moving forward to a faster DRAM, DDR5. DDR5 improves power management (1.1V vs. 1.2V for DDR4) as
Read More
2021Jul 29
details

Micron 1α DRAM Technology

DRAM Memory Technology Micron D1α, '14 nm'! The Most Advanced Node Ever on DRAM! D1α! It’s 14 nm! After a quick view on Micron D1α die (die markings: Z41C) and cell design, it’s the most advanced technology node ever on DRAM. Further, it’s the first
Read More
2021Jul 8
Sony IMX990

Groundbreaking SenSWIR Sensor by Sony- IMX990/IMX991

This approach presents two advantages, the Cu-Cu DBI can help reduce the overall height of the Die while Die-to-Wafer hybridization can help reduce the per-Die cost, thereby facilitating greater utilization of Sony’s SWIR technology for a wide range of applications. Recently, TechInsights revealed the first detailed cross-sectional image of the 1.34MP.
Read More
2021May 19
Qualcomm Snapdragon 888

Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market

February 03, 2021 Logic Disruptive Technology Download the brief Qualcomm Snapdragon 888 in the Xiaomi Mi 11 brings a new 5 nm entrant to market With their release of the Snapdragon 888, Qualcomm finds itself in competition with other 5 nm offerings
Read More
2021Feb 3
Sony d-ToF Sensor found in Apple’s new LiDAR camera

Sony d-ToF Sensor found in Apple’s new LiDAR camera

January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry
Read More
2021Jan 19
SK hynix 128L 3D PUC NAND

SK hynix 128L 3D PUC NAND (4D NAND)

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral
Read More
2020Sep 14
Qualcomm's Snapdragon SDR865 Transceiver

Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services

The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to
Read More
2020Apr 27
Exynos 990

TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990

Last year, Samsung announced the introduction of EUV into their 7LPP process used in the Exynos 9825. Through analysis of the part, we found little difference between their 7LPP process in the 9825 and their 8LPP process in the Exynos 9820. Now, we
Read More
2020Mar 18
Recent Analysis of Samsung’s Mobile RF Components

Recent Analysis of Samsung’s Mobile RF Components

Shannon 5800 55M5800A01 As the industry expands its use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors
Read More
2020Mar 3

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