Discover the highlights of Micron's Q1 2024 report, showcasing impressive growth and strategic advancements in the semiconductor industry. Gain insights into Micron's market outlook and innovative initiatives shaping the future of semiconductors.
Renesas and TSMC demonstrated two uses of fast MRAM at ISSCC. Renesas targets faster NVM; TSMC targets working memory. Their tradeoffs are very different.
AI-capable notebook PCs– defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) –will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.
In Q4 2023, Latin America's smartphone market experienced significant growth driven by economic improvements, festive occasions, and the introduction of new Apple iPhone models.
Anticipate and adapt to automotive semiconductor landscape changes with market projections, emerging tech insights, and key demand drivers. Gain valuable foresight now.
Apple is rumored to launch new iPad Pro models with the M3 chip and even new iPad Air models in late March 2024, kicking off a year of iPad updates. These will be important updates to Apple’s portfolio and should be cast in the new light of what is possible with on-device AI to reinforce the messaging that iPads are PC replacements as well as entertainment devices.
In this briefing we focus in depth on a highly integrated PMIC designed for multi-port charging applications from Infineon, the CYPD7271-68LQXQ. It incorporates an ARM® Cortex®-M0 32-bit MCU, 128 KB Flash, 32 KB ROM, 16KB SRAM and power devices all on a single die with the embedded flash observed to be a silicon-oxygen-nitrogen-oxygen-silicon (SONOS) design.
Discover the latest advancements and insights unveiled by NVIDIA in our blog, keeping you informed on cutting-edge technology and developments in the tech industry.
Three times a year we curate important updates, supplementary analysis of recent reports, high-level packaging process flows, and sneak peeks at upcoming devices and packaging reports. The result is an Advanced Packaging Analyst’s Briefing, and this year it has a new video format, the first of which is now available on-demand to our subscribers.
By now, you’ve surely read plenty about the quiet canceling of Apple’s Titan AV effort. Most of the focus has been on what it means for Apple. This Chip Insider® steps back to see the darker picture Titan’s fall from grace paints about the future of AVs.
With the expansion of the RA8 series, Renesas is integrating Arm’s highest-performing Cortex-M CPU in microcontrollers optimized for graphics display and motor control applications.
NVIDIA's latest unveilings represent a significant leap forward in technological innovation across various domains. The introduction of the Blackwell GPU, while lacking specific performance metrics, hints at enhanced capabilities, especially with its integration into the DRIVE THOR SoC.
Unlock the future of imaging technology with TechInsights' groundbreaking discovery: Samsung's inaugural imager boasting innovative hybrid bond technology.
