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Hybrid Bonding Technology - 2023 and beyond

Hybrid Bonding Technology - 2023 and beyond

Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
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20232月 1
Join TechInsights’ Leading Market Analysts at the 2023 Mobile World Congress

Join TechInsights’ Leading Market Analysts at the 2023 Mobile World Congress

Leading market and technology analysts from TechInsights will be attending the Mobile World Congress (MWC) in Barcelona, Spain Feb. 27 – Mar. 2, 2023. During the event, our analysts will conduct business meetings, moderate conference sessions, attend briefings and provide media interviews.
Read More
20231月 30
Power of the Chip Series

Power of the Chip Series

This short-form video series will cover topical events and include insightful commentary from our TechInsight’s experts (and surprise guests) on how powerful this tiny object is.
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20231月 30
Lithography: Now and Then

Lithography: Now and Then

Advanced lithography techniques, which are required to print ultrafine features on to chips, are primary enablers of modern technology advancement. There are many different lithographic techniques, with EUV considered the modern-day frontrunner leading the way to the world’s most advanced chips.
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20231月 26
Throwback to 2021 CIS Technology Trends

Throwback to 2021 CIS Technology Trends

CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.
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20231月 26
iPhone 14 Pro's new ambient light sensor- inside the package

iPhone 14 Pro's New Ambient Light Sensor – Inside the Package

Apple’s annual big reveal in September 2022 promised an iPhone 14 with “a re-engineered proximity sensor”, detecting light from behind the display to save additional space. This is the type of announcement the CIS subscription likes to hear about, and indeed our initial teardown analysis showed that Apple decided to change their approach to the proximity sensor.
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20231月 25
Xiaomi 120 watt, 19 minute HyperCharging: An adaptive charging protocol using the SurgeP1 charging IC

Xiaomi 120 watt, 19 minute HyperCharging: An adaptive charging protocol using the SurgeP1 charging IC

The innovation seen within smartphones, including increasingly faster charging speed, has been exciting to watch over the past year. Key players like Xiaomi, Realme, Samsung, and Black Shark are leading the pack in this space with Xiaomi and Realme as the top competitors, surpassing 100 W.
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20231月 25
The Continuously Evolving Landscape of Memory Technology

The Continuously Evolving Landscape of Memory Technology

The memory technology landscape is continuously evolving. DRAM and NAND Flash memory demands have been steadily increasing and emerging memory markets such as STT-MRAM, ReRAM, PCRAM, FeRAM, and 3D XPoint memory are expected to reach $36 billion by 2030. As emerging memory makers race ahead of device scaling, they will face several challenges.
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20231月 24
Who made our top picks in IoT Connectivity for 2022?

Who made our top picks in IoT Connectivity for 2022?

"It was a busy year in the IoT connectivity landscape in 2022. TechInsights’ team of subject-matter experts and analysts worked hard at identifying the key events, technologies, and design practices to include in our IoT SoC subscription."
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20231月 23
Comparison: Latest 3D NAND Products from YMTC, Samsung, SK hynix and Micron

Comparison: Latest 3D NAND Products from YMTC, Samsung, SK hynix and Micron

TechInsights ran a comparison of the YMTC 232-L against 128- and 176- layer solutions from Samsung, SK hynix, and Micron, looking at factors like die size, bit density, active layers, word line pitch, and more.
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20231月 12
A Trip Down TSMC Memory Lane – Part 2

A Trip Down TSMC Memory Lane – Part 2

Logic Blog A Trip Down TSMC Memory Lane – Part 2 Dick James To start Part 2 of the blog, we backtrack to 1998, when the 0.25-µm process was launched. One of the comments from Shang-Yi Chiang’s (former VP of R&D at TSMC) oral history was that when he
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20231月 5
MobileRF-YIR-hp

Mobile RF Year in Review - Who Made Our Top Picks for 2022?

Mobile RF Blog Mobile RF Year in Review - Who Made Our Top Picks for 2022? 2022 has been a busy year in the mobile RF landscape. TechInsights’ team of subject- matter experts and analysts have been hard at work identifying the key events
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202212月 20

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