TechInsights’ Radu Trandafir takes a closer look at the three mmWave antenna modules used by Apple in the iPhone 12/13 which mark an interesting departure from the “traditional” Qualcomm-based architecture at the implementation level.
Like Bluetooth, the UWB is a short-range, low-power, radio-based communication technology whose primary purpose is for location discovery and device ranging. However, UWB offers a multitude of different functions, such as fast and reliable file-sharing features and secure transactions.
TechInsights comments on what the main reasons for this integration are, other innovations throughout the GaN die, and how there is not a ‘one size fits all’ approach in regard to power semiconductor devices.
Dick James, a Senior Fellow and Technology Analyst with TechInsights, entered the semiconductor industry in 1970, working for Philips Semiconductor. In this blog, he presents a retrospective of gate technology, ranging from 1971’s 10-micron design rules (!) through to the more modern 5-nanometer.
If you want to understand the progress of competitors and the recent situation of the market, this presentation reviews selected structural and feature highlights of Apple, Samsung, Xiaomi, Vivo, Huawei, and Sharp cameras, focusing on main & ultrawide cameras, and the periscope camera trends.
The Package channel continued building its periscope camera report database with a look inside the Sony Xperia 5 III smartphone. Notably, this is the first periscope camera TechInsights has examined that has a variable zoom; the magnification of the camera has two zoom settings.
TechInsights partners with Cipher to harness ML to leverage patent intelligence to reveal insight about the future direction of the Semiconductor industry
TechInsights’ Linley Processor Conference – the industry’s premier technical event for microprocessors – returns this year, beginning this month with a must-see lineup of presentations revolving around the future of artificial intelligence.
TechInsights reviews additional considerations compared to silicon to optimize device performance, the challenges associated to thermal management, and other innovative solutions related to GaN specific packaging solutions.
