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Teardown Technology Apple introduced the new iPad Pro (2021) on April 20th, will it be the most powerful and advanced iPad Pro ever? The Apple-designed M1 chip is the foundation and main contributor to the performance increase. TechInsights has already analyzed the TSMC N5 FinFET process fabbed M1

May 5, 2021 Teardown Technology A quick look inside the Apple Homepod Mini design wins, but is there a secret part waiting to be intialized? The Apple HomePod Mini A2374 is a voice-interactive smart speaker with Siri assistant. It features four microphones delivered by Goertekand a capacitive touch

April 30, 2021 Dr. Jeongdong Choe Intel's 2nd Generation XPoint Memory - Will it be worth the long wait ahead? In 2017, TechInsights analyzed the details on Intel 1st gen. XPoint Memory (OptaneTM Memory 16GB, MEMPEK1W016GA) including structure, materials, process, design, and circuit as well. Since

April 21, 2021 Kyle Nolan Qualcomm extends their mmWave leadership position 5G mmWave is still far from worldwide adoption but Qualcomm is keeping their foot on the pedal despite no one really close on their tail. One of Qualcomm’s Sr. Directors of 5G Technology in Europe, George Tsirtsis, stated in

April 16, 2021 Dr. Jeongdong Choe Originally published in Samsung D1z LPDDR5 DRAM with EUV Lithography (EUVL) Finally! After months of waiting, we have seen Samsung Electronics’ applied extreme ultraviolet (EUV) lithography technology for D1z DRAM in mass production! Early last year, Samsung

March 30, 2021 Embedded & Emerging Memory World’s First 1 Gb 28 nm STT-MRAM Product - by Everspin Everspin’s new 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with a 28 nm process is the world’s first 1 Gb STT-MRAM product. This 4th generation MRAM

March 23, 2021 Abdullah Rahal TechInsights identifies some of Blackberry’s highest value patent assets through portfolio analysis TechInsights’ analysts have examined the Blackberry patent portfolio and partitioned it into a dozen application areas, as well as marked a subset of the patents as high

March 23, 2021 Dr. Jeongdong Choe KIOXIA’s new XL-FLASH for ultra-low latency NAND application We’ve just found a new XL-FLASH product with 96L BiCS4 NAND cell architecture from KIOXIA. According to KIOXIA, XL-FLASH is extremely low-latency, high-performance Flash Memory that is based on 3D BiCS

March 16, 2021 Ziad Shukri Dynamic Vision Sensors – A Brief Overview Dynamic Vison Sensors are Asynchronous imagers. Much like the human eye, they are designed to respond to changes in brightness, with no “Frames” to capture. With DVS, individual pixels independently produce an output only if there

March 16, 2021 Dr. Jeongdong Choe Advanced 1 Gb 28 nm STT-MRAM products from Everspin Technologies We’ve been waiting for a long time to see the technology details of Everspin’s new stand-alone 1-Gigabit (Gb) Spin Torque Transfer Magneto-resistive Random Access Memory (STT-MRAM) device with 28 nm

March 9, 2021 Dr. Jeongdong Choe A New and advanced ReRAM from Fujitsu We’ve been analyzing a new ReRAM product from Fujitsu Semiconductor. Fujitsu 8 Mb MB85AS8MT is the world’s largest density as a stand-alone mass-produced ReRAM product. The MB85AS8MT is a non-volatile emerging memory with SPI

March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights has been monitoring this market for the past couple