Renesas R7F702301BEBBA-C_BC6 TSMC 28nm Embedded Flash Advanced Memory Essentials
Share This Post
This report provides insight on the structure and materials used in the manufacture of the Renesas R7F702301BEBBA-C_BC6 microcontroller comprising a die fabricated using TSMC 28 nm HPL HKMG CMOS process with embedded flash (eFlasH). The report includes a summary of key findings, and a detailed look at the eFlash array and peripheral structures and materials used. SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
