OmniVision ISP from OX03D4C, 1/4” Format, 3.0MP Resolution, 2.1μm Pixel Pitch, Stacked Back-Illuminated CMOS Sensor Advanced Floorplan Analysis

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This report presents an Advanced Floorplan Analysis of the ISP die from the OmniVision OX03D4C, 1/4” format, 3.0 MP resolution, 2.1 μm pixel pitch, stacked back-illuminated CMOS Image sensor for automotive applications. This die features a stacked system on chip (SoC) image sensor with HDR, LFM capability and RCCB CFA, 140dB, low power consumption below 500 mW.

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