Discover the HiSilicon Hi1105-GFCV150 die, uncovered inside its component from the Huawei Mate 70 Pro+—a glimpse into Huawei’s latest tech innovation!
The HiSilicon Hi1105-GFCV150 die was found inside the HiSilicon Hi1105-GFCV150 component. The HiSilicon Hi1105-GFCV150 component was extracted from the Huawei Mate 70 Pro+ smartphone.
Unpacking the Semiconductor Pricing Battle
Gain exclusive access to data-backed analysis of Power, DRAM, and NAND market pricing shifts—plus supplier strategies and future forecasts.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
Stay informed on the latest shifts in semiconductor policy, AI, packaging, and market dynamics in the June 2025 Chip Observer, featuring insights on Qualcomm, OpenAI, Huawei, and more.
US Tariffs and Taiwan Curbs Reshape Semiconductor Supply
Trump’s tariff threat and Taiwan’s export curbs on Huawei and SMIC add new risks and delays to global semiconductor supply chains and chip manufacturing plans.
