TSMC Goes Big, Samsung Small at 3 nm

TechInsights looks at the world’s first 3 nm products. Apple’s A17 chip from the iPhone 15 employs TSMC’s FinFET process, and Samsung quietly released their first gate-all-around nanosheet chip in the WhatsMiner cryptocurrency rig.
22Dec

AMD’s MI300X Takes On H100

AMD is targeting the data-center AI acceleration market with its MI300X accelerator. The 3D chiplet is based on CDNA3 architecture and offers up to 2 PetaOPS INT8 performance.
22Dec

Synopsys Joins RISC-V Bandwagon

Synopsys has added RISC-V to its CPU portfolio with three ARC-V families. Application coverage extends from small low-power functions to 64-bit multicore and multicluster high-performance embedded designs.
04Dec

Codasip Protects Memory With Cheri

Codasip’s new A730-Cheri RISC-V application CPU is the first commercial implementation of the Cheri fine-grained approach to memory protection that enables omission of a large memory-protection unit
27Nov

Scaling Turns Into More-Than-Moore

Integrated-circuit scaling has enabled semiconductors to become an indispensable part of industry. Moore’s Law and Dennard scaling have developed into design- and system-technology co-optimization to overcome the challenges posed by data centers, AI, and consumer demand.
27Nov