Intel Drops Hyperthreading From New CPU

Intel’s Lion Cove contains significant departures from previous CPU microarchitectures, prioritizing performance efficiency by omitting hyperthreading and other performance-boosting innovations but still manages to deliver a double-digit IPC uplift.
22Jul

Microprocessor Report June 2024 Review

Microsoft’s Copilot+ PC demands saw Qualcomm, Intel and AMD all launch new PC SoCs with advanced NPUs. Intel’s Gaudi 3 will compete with NVIDIA—although only NVIDIA’s previous generation H100. Advanced packaging is a significant industry trend, and AR is a driving force behind new packaging technologies from TSMC seen in the Apple R1, and an experimental SoC from Meta.
22Jul

Lunar Lake Packs Big Efficiency Boost

Intel’s Lunar Lake, the biggest overhaul of its architecture for PC processors since the addition of efficiency cores with Alder Lake, promises a big leap in power efficiency that may nullify AMD’s long-standing advantage in this metric.
15Jul

Apple R1 Adopts TSMC’s Latest Package

Apple’s R1 sensor hub chip in the Vision Pro AR/VR headset is the first use that TechInsights has seen of TSMC’s InFOM advanced packaging technology. The R1 has a 5nm processor chip plus two LLW DRAMs linked by short very-high-density interconnect to speed up the data processing.
15Jul

May in Review: AI at the Edge

Processor companies are packing more neural processing capability into processors for IoT edge devices. Here’s a look back at several of these that we covered in May.
04Jun

Meta’s AR Enhanced by 3D Packaging

Meta’s Reality Labs discussed a prototype AR processor at the 2024 ISSCC, fabricated using hybrid bonding as 3D packaging. This improved performance for the trial tasks of hand tracking and image processing.
04Jun