The Ray-Ban Meta Wayfarer Smart Glasses comes with a 12 MP ultrawide-angle camera that captures high-quality photos and videos and a five-mic array audio system that takes audio-rich immersive videos. The camera uses the SONY IMX681, which is a stacked Back-Illuminated (BI) CMOS image sensor (CIS) with 12 MP resolution and 1.00 µm pixel pitch.

The TMRV93 die was found inside the Apple APL1206 M4 processor. The Apple M4 component was extracted from the Apple iPad Pro released on May 7, 2024. The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately.

Huawei Pura 70 Pro+ is a premium smartphone from Huawei flagship Pura series. Designed with a HiSilicon Kirin 9010 octa core Applications/Baseband processor, a 5050 mAh battery with 100W super fast charge, a 50MP/12.5MP/48MP rear camera, and a 13 MP front camera.

As STMicroelectronics’ first automotive device in the new STPOWER MDmesh DM9 AG series, the STH60N099DM9-2AG, announced on March 11, 2024, features an N-channel 600 V Si SJ-MOSFET die which provides a maximum continuous source/drain (S/D) current of 27 A (at T = 25 °C) and a 76 mΩ typical source/drain (S/D) ON-resistance (RDS(ON)) at 10 V VGS bias.

Global fitness band industry revenues slowed their decline in Q1 2024, falling just 10% YoY after an average quarterly decline of 35% over the past 3 years. This marks the sixteenth consecutive quarter of fitness band revenue declines.

This report summarizes forecasts for the European market for xEV systems, semiconductors, and sensors. Despite uncertainties such as Ukraine conflict, semiconductor shortages, and a slowing global economy, the momentum towards electrification and battery electric vehicles remains robust, with volume demand continuing to rise.

The Qualcomm HG11-58812-110 was found inside Qualcomm QCN6402-001 Wi-Fi 7 RF transceiver. The QCN6402-001 was extracted from the Xiaomi RD15 Wi-Fi 7 mesh router. This router was launched in retail markets in January 2024.

The SDR875-001 is part of Qualcomm’s Snapdragon 8 Gen 3 mobile platform, and delivers both FR1 and FR2 bandwidth transceiver functions in a single device. This is a new design strategy - previous platforms featured separately packaged transceivers - and this report examines the packaging details in support of the ‘converged’ device.

The Winbond WBGAA107X die was found inside Winbond W66CQ2NQUAFJ 2 Gb LPDDR4X DRAM package. Winbond is a specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, it is the only company in Taiwan with the ability to develop DRAM and flash products in-house.

The Xiaomi Smart Door Lock E20 is a Wi-Fi smart lock, designed with fingerprint, password unlock, NFC unlock, Bluetooth 5.0, eight 6V AA batteries, and 5V type-C emergency power.

This database provides a panoramic view of key battery cell manufacturers worldwide, covering the areas of their product roadmap, manufacturing capacity, relationships with OEMs and non-OEMs, as well as their raw material suppliers.

The Regional Technology and Innovation Hubs program aims to spread R&D capabilities throughout the US, expanding beyond Silicon Valley’s orbit.