Nokia, in its present incarnation as a telecom equipment vendor, was formed by a series of mergers & acquisitions, principally Nokia, Siemens Networks, Alcatel, Lucent, and Motorola’s cellular infrastructure group as well as some smaller acquisitions (Newbridge Networks, Ascend Communications etc.)

AI-capable notebook PCs - defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) – will represent 95% of the total notebook PC market, or 227.3 million units, shipped in 2029.

This report provides a detailed analysis into the structure of the OmniVision OV50H CIS. The analysis includes structural and material analysis and details of the structural dimensions, which are used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.

The overall Datacenter Computing Processor market was $29.7 billion in Q1 2024, close to +200% year-over-year (3x), driven by stellar GPU shipments and sustained ASIC demand. The CPU and FPGA markets are bottoming out with accelerated year-over-year growth expected through 2024.

The Bosch MRR1Plus (5Q0 907561B) automotive radar sensor uses 77 GHz front-end radar transmitter and receiver ICs from Infineon.

In addition to the battery essentials report (BEF-2312-801) that recently provided important structural and morphological insights, this report presents a Battery Characterization (BCR) analysis of the Desay 26S1029 Li-ion battery extracted from the Amazon Echo Frames 3rd Generation smart glasses.

The market for smartphone fingerprint sensors secured over 5% revenue growth in Q1 2024. Qualcomm took the top spot followed by Goodix and Egis Technology in the quarter.

Insight into the structure of the STMicroelectronics VB1940 CMOS image sensor ISP die for automotive applications, which is a 5.1 MP, 1/2.5” stacked back-illuminated RGB/NIR technology CIS with a pixel pitch of 2.25 µm.

The Synaptics VideoSmart VS680 AI SoC found in Banana Pi BPI-M6 single board computer, using TSMC 12nm CMOS FinFET (likely 12FFC) process.

Quectel announced RG255C-GL module with 5G reduced capacity sub-6GHz on April 9, 2024 designed for global market. It is embedded with Qualcomm Snapdragon SDX35 Baseband Processor and JSFCBA3YH3BBG-425 RAM/NAND memory from Jeju Semiconductor.

Global smartwatch revenues fell by 4% YoY during Q1 2024. The decline was driven by slumping shipment volumes and declining ASPs due to macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending and causing a lengthening replacement cycle.

The models included in the report cover 90% of the total smartphone shipments in Q1 2024, including all major vendors as well as many locally significant microvendors.