Global Differences in Assisted Driving Interest and Adoption

TechInsights undertook a survey of 4,630 car owners in the US (1,510), China (1,510), the UK (401), France (402), Italy (402), and Germany (405), covering their likelihood to have bought a car with full-self driving technology, use other transport options with self-driving capabilities, or recommend certain self-driving features to others.
04Jul

FinFET Transistor Evolution

FinFET transistors have replaced planar channel transistors, beginning with Intel’s 22nm process node, and the 16nm process nodes from the major foundries. This article discusses the basics of FinFET transistors, and why this transition was necessary, as well as showing how FinFET physical dimensions impact DC performance.
04Jul

Rimac Previews Verne Ride-Sharing Service

The Verne ride-sharing service was launched on June 26, 2024. The announcement is of a complete service, not just of a concept that will see further development. Verne, previously known as P3 Mobility, will come with a fleet of stylish two-seat battery electric vehicles conveying customers with a fully autonomous (SAE Level 4) driving system developed with Mobileye.
03Jul

China: Automaker Strategy Tracker 2024 Update

This data file provides in-depth analysis of OEMs' strategies in China. It illustrates each OEM's positioning in the market, their group strategy, and describes how each company is implementing each strategy for different aspects of their operations and products, such as connected car and cockpit, ADAS and autonomous driving, new energy vehicles, each automaker's semiconductor-related strategy (if applicable), and for the R&D institutions of a given OEM.
03Jul

Skyworks SKY58109-51 MHB L-PAMiD Packaging Analysis

The SKY58109-51 is a highly-integrated front end module. It incorporates advanced RF packaging techniques, including Skyworks' trademarked SkyShield self-shielding system. Additional packaging strategies are leveraged to reduce the package footprint and save space in the downstream product. Those strategies include integrated inductors, top and bottom-side mounted dies, and even die stacking.
03Jul

Rimac Previews Verne Ride-Sharing Service

The Verne ride-sharing service was launched on June 26, 2024. The announcement is of a complete service, not just of a concept that will see further development. Verne, previously known as P3 Mobility, will come with a fleet of stylish two-seat battery electric vehicles conveying customers with a fully autonomous (SAE Level 4) driving system developed with Mobileye.
03Jul

Chiplet Market – Compute Segment

The advent of chiplets marks a fundamental change in semiconductor design and production, at a time when design costs are skyrocketing. A chiplet marketplace is expected to develop, where designers can mix match chiplets from a variety of suppliers to be produced at different foundries at the optimum process nodes.
03Jul