Oppo A60 is a low-range smartphone for Emerging Asia markets. Designed with Qualcomm Snapdragon 680 platform, 5000 mAh battery including 45W SUPERVOOC, 50MP/2MP rear camera and 8 MP front camera, 6.67 inch 1604x720 pixel display.

Chinese EV exports declined 13.2% in June, marking a third consecutive monthly drop due to new trade barriers from the US and EU. In response, BYD plans to invest $1 billion in a Turkish factory to bypass EU tariffs, with production starting by late 2026. This facility, along with a new factory in Hungary, highlights BYD's strategy to navigate regulatory challenges and sustain its European market presence.

A comparison of the recently analyzed 1YY-L quad-level cell (QLC) 3D NANDs (Samsung V7 QLC, KIOXIA/WD BiCS6 QLC, Micron Gen5 QLC and Solidigm Gen5 QLC) with YMTC Gen4 QLC 3D NAND is presented. In addition, projection of KIOXIA/WD QLC to achieve bit density of 100 Gb/mm2 for one thousand layers 3D NAND is made.

The Nordic TMJD13 die was found inside the Nordic nRF52840 component. The nRF52840 component was extracted from the RAKwireless RAK4630 LoRa Bluetooth module. The nRF52840 component is positioned as a multiprotocol RF transceiver for wireless connectivity.

Apple iPad Pro 13" is Apple's thinnest product ever at 5.1mm. It is available for both Wi-Fi/Cellular connectivity. It is designed with the new Apple M4 chip APL1206 Application Processor and Qualcomm SDX70M Baseband Processor, 13" XDR display 2752x2064 pixels, front and rear 12MP cameras.

This report provides a preliminary analysis of the structure and materials used in the manufacture of of the Samsung Exynos W1000 wearable processor die, fabricated using the SF3 process, Samsung’s second-generation (gate-all-around) GAA process.

HP Omen 16 2023 laptop is released specially for gaming applications, powered by AMD Rayzen 7840H processor and NVIDIA GeForce RTX 40 series graphics processor. Laptop designed with Wi-Fi 6e/Bluetooth 5.3 and 2TB PCIe Gen 4 Samsung SSD.

This report provides a detailed analysis into the structure of the Canon LBC010 SPAD die. The analysis includes structural and material analysis and details of the structural dimensions, which are used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.

This report provides an extended insight into the structure of the Galaxycore GC32E1 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor, including a summary of the salient features observed, and accompanied by a set of optical, SEM cross-section, and bevel images of the CIS die.

In 2024, semiconductor sales started experiencing robust growth. The total market for semiconductors grew by 24% in the first half (1H) of 2024 and is expected to continue surging in the second half (2H) at a rate of 29%.

The July Update to the McClean Report reviews semiconductor industry capital spending and capacity. Semiconductor fabrication is an exceptionally capital-intensive process.

TechInsights expects LG’s acquisition of Athom to deliver a win-win for both companies and will help LG to narrow the gap on its smart home ecosystem competitors, Samsung, Amazon, and Google.