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Published: 19 June 2017

This report presents a Digital Functional Analysis of the Samsung S5E8895A01 die found inside Samsung Exynos 8895
PoP component. The Exynos 8895 component was extracted from a Samsung Galaxy S8 smartphone with the model number
SM-G950N.

This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/STI, gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to polysilicon
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

Report Description

This report presents a Digital Functional Analysis of the Samsung S5E8895A01 die found inside Samsung Exynos 8895 PoP component. The Exynos 8895 component was extracted from a Samsung Galaxy S8 smartphone with the model number SM-G950N.

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