For over 25 years TechInsights has been a trusted patent and technology partner to the world’s largest and most successful companies including 37 of the top 50 U.S. patent holders. By revealing the innovation others can’t inside the broadest range of advanced technology products, we prove patent value and enable business leaders to make the best, fact-based IP and technology investment decisions.
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We asked our team what they thought were the most interesting developments in their respective fields in 2017.
We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.
TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.
A teardown of the Samsung Gear Fit2 Pro SM-R365 Fitness Band, take a look at what we found inside.
The phone is in and our preliminary findings have been published. Follow our blog for updates as we continue to examine this phone.
Significant intellectual property has been developed around these algorithms related to error correction, read-retry techniques, wear leveling, garbage collection, data flush, and data trimming, amongst others.
Apple, Huawei and Samsung – TechInsights has conducted an in-depth analysis of each provider’s most recent contenders.
The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.
While Apple and Samsung have been engaged in a tug-of-war for the title of top-selling smartphone provider over the past couple of years, China’s dominant OEM - Huawei - has been quietly gaining traction globally with their P- and Mate-series offerings.
TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).
3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.
The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process...
The WTR5975 is a member of the Snapdragon 835 family found in the Samsung Galaxy S8 and is the world’s first single-chip RF IC supporting Gigabit Class LTE, LTE-U, and LAA with 5 GHz unlicensed band support.
Patents allow you to protect your inventions, license the use of the inventions of others, and introduce additional revenue streams to your business.
In this exclusive analysis piece, IAM provides a detailed look at each company’s patent position, as well as a summary of the big issues they have faced over the last five years.
As microchips become 3-D, there are dividends in performance, power consumption and capabilities.
It is interesting to see what the cost differences are and how much more money Apple makes by selling an X, especially when millions or tens of million units are involved.
Apple Inc’s new flagship iPhone X makes the company more money per phone than its iPhone 8 model, according to an analysis, which found the iPhone X’s flashier parts cost Apple 25 percent more than the iPhone 8, but that it retailed 43 percent higher.
Apple continues to use a mix of Qualcomm and Intel cellular baseband processors in the iPhone X. Teardowns of the handsets also show that the company employed a combination of new and old tricks to pack features into its new flagship smartphone.
Martin Bijman, Director, Intellectual Property Products, TechInsights, explores the factors involved in understanding and determining the value of your patent portfolio, concentrating closely on the importance of subject matter experts to do so.
The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.
TechInsights explored some of the Bluetooth and cellular IoT devices that it expects will dominate the Internet of Things for some time.
With a history stretching back more than 60 years, the IEEE International Electron Devices Meeting (IEDM) is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology.
Taking place in Amsterdam in March 2018, the event will provide IP owners in Europe with tools and insights that will enable them to craft world-class IP management and value creation programmes.
IPBC Global has cemented itself as the global gathering for the world’s IP business leaders since it was first held back in 2008. From June 10 to 12 2018, IPBC Global will enter its second decade when the world’s IP elite will assemble at the Palace Hotel, San Francisco for the 11th annual event.