Effective January 1, 2017, Chipworks merged with TechInsights to create the World’s premiere company for revealing the innovation others can’t inside advanced technology. With almost half-a-century of combined experience, and specialized products and services, the new TechInsights enables business leaders to make the best, fact-based IP and technology investment decisions.

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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
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Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
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Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
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Patent Intelligence Blog
Growth by Acquisition: Qualcomm in Talks to Acquire NXP

Read on for an analysis of what this acquisition means to the patent portfolio of Qualcomm.

Patent Intelligence Blog
Who will acquire Intersil?

Speculation about who will acquire analog semiconductor manufacturer Intersil is high in the latest chapter of the 2016 Mergers and Acquisitions story.

Patent Intelligence Blog
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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
View Post
Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
View Post
Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
Intel 3D XPoint

3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.

Latest Reports
Samsung 10 nm LPE Process

The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process...

Latest Reports
Qualcomm WTR5975 Gigabit LTE Transceiver

The WTR5975 is a member of the Snapdragon 835 family found in the Samsung Galaxy S8 and is the world’s first single-chip RF IC supporting Gigabit Class LTE, LTE-U, and LAA with 5 GHz unlicensed band support.

Latest Reports
Four TechInsights Executives Recognized as Outstanding IP Strategists

Mike McLean, Ian MacLean, Art Monk, and Terry Ludlow, named in 2017 list of World's Leading IP Strategists by Intellectual Asset Management (IAM).

Latest News
TechInsights Confirms Apple’s A10X SoC Is TSMC 10 nm FF; 96.4mm2 Die Size

One of the more intriguing mysteries in the Apple ecosystem has been the question over what process the company would use for the A10X SoC, which is being used in the newly launched 2017 iPad Pro family.

Latest News
TechInsights Finds Microsoft Azure IP Advantage Portfolio Ranks First in Cloud Innovation

Analysis Finds the Microsoft Azure IP Advantage outranks IBM, Oracle, Google, Amazon, and VMware’s Cloud portfolios, indicating a solid footing in Cloud innovation.

Latest News
Flash Memory Summit, Santa Clara, CA

Flash memory is a key technology enabling new designs for many products in the consumer, computer and enterprise markets.

Latest Events
IPO Annual Meeting, San Francisco, CA

The San Francisco IPO Annual Meeting offers a mix of educational programs, committee meetings, networking opportunities, and exhibits.

Latest Events
IAM Patent Licensing, San Francisco, CA

In its third year, Patent Licensing 2017 will once again bring together experts from across the licensing world with a focus on responsible deal making in an uncertain market.

Latest Events
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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
View Post
Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
View Post
Technology Blog
Memory/Selector Elements for Intel OptaneTM XPoint Memory
TechInsights has continued to dig into the process, cell structure and materials analysis of the Intel OptaneTM XPoint memory.
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Technology Blog
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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
View Post
Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
View Post
Technology Blog
SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation
Low yield and reliability issues on 21 nm 1st generation, means their new 2nd generation 21 nm DRAM cell technology has caught the attention of many producers of memory products.
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Technology Blog
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A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
View Post
Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)
This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop.
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Technology Blog
Sony Launches First Three-Layer, 960 fps Camera with Sandwich-Stacked DRAM
During the ISSCC conference last Februry, sony issued a press release describing the "Industry's First 3-Layer Stacked CMOS Image Sensor with DRAM for Smartphones...
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Technology Blog