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SanDisk-Toshiba 15 nm NAND CircuitVision Analysis of Selected Blocks

This CircuitVision report provides a set of hierarchical schematics for the SanDisk/Toshiba 15 nm NAND Flash.

Samsung 16 nm 64 GB NAND Flash Memory

The K9PHGY8S7D 64 GB NAND flash memory is used in Samsung�s SM951 solid state disk drive.

Samsung 3D V-NAND Flash Memory

Samsung�s 3D V-NAND features a proprietary vertical cell structure and represents a breakthrough in...

SK Hynix H2JTDG8UD1BMS 16 nm NAND MLC Flash Memory

SK Hynix H2JTDG8UD1BMS, 16 GB, 16 nm node MLC NAND Flash memory used in the Apple iPhone 6 Plus smartphone.

 
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CircuitVision Analysis of the Hynix H9HKNNNBTUMU LPDDR4 Mobile DRAM Memory

This CircuitVision analysis covers circuit extraction, analysis and organization of all unique circuit blocks on a single die in the SK Hynix H9HKNNNBTUMU LPDDR4 Mobile DRAM.

 
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CircuitVision Analysis of the Major Blocks on the Samsung LPDDR4 Mobile DRAM

This Circuit Vision analysis covers circuit extraction, analysis and organization of all major circuit blocks of the Samsung LPDDR4 Mobile DRAM die.

SK-Hynix High Bandwidth Memory (HBM) Package Analysis

AMD has just released their Radeon R9 Fury X Series of GPUs featuring 4 GB of SK-Hynix�s high bandwidth memory (HBM).

Samsung DDR4 SDRAM with TSVs Package Analysis

The report is a detailed structural analysis of the Samsung K4A4G045WD-CRB DDR4 SDRAM with TSVs.

 
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Rockchip RK3028A SoC SMIC 40 nm LP Process Logic Detailed Structural Analysis

The RK3028 is an entry level dual-core tablet solution SoC fabricated using SMICs 40 nm LP process.

TSMC 16 nm finFET Process in Apple A9 Processor - Logic Detailed Structural Analysis

The report is a detailed structural analysis (LDSA) of the Apple A9 process fabricated using TSMC�s 16 nm finFET process.

UMC 28 nm HKMG Process Detailed Structural Analysis

The devices features metal gate transistors fabricated using a high-k first, metal gate last process, with a nominal 120 nm minimum contacted gate pitch.

Samsung 14 nm Exynos 7 7420 Logic Detailed Structural Analysis

The 64-bit octa-core Exynos 7 (Exynos 7420) is a high end eight CPU core SoC first used in Samsung�s Galaxy S6 and S6 edge smartphones.

 
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NFC NXP PN549 found in the iPhone 6s CircuitVision Analysis

TechInsights has uncovered NXP�s PN549 Near Field Communications (NFC) Controller in the Apple iPhone 6s.

Analysis of NXP NFC PN548 IC found in Apple iPhone 6 and Samsung Galaxy S6 Edge

The devices features metal gate transistors fabricated using a high-k first, metal gate last process, with a nominal 120 nm minimum contacted gate pitch.

Qualcomm WTR3925 Circuit Analysis

Qualcomm recently started shipping the world�s first 28 nm transceiver: the WTR3925, and we have completed full circuit analysis...

Qualcomm WTR1625 CircuitVision Analysis of the Analog Circuitry

Expanding high-speed 4G network is driving demand for smartphones with leading-edge technology like the widely used Qualcomm WTR1625...

 
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Rockchip RK3028A SoC SMIC 40 nm LP Process Logic Detailed Structural Analysis

The RK3028 is an entry level dual-core tablet solution SoC fabricated using SMICs 40 nm LP process.

 
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Apple 3D Touch Sensor from the Apple iPhone 6s Custom Structural Analysis

The iPhone 6s and 6s Plus smartphones have introduced the first use of force detection for user interaction in a smartphone with the 3D Touch sensor.

 
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Sony 12 Megapixel Backside Illuminated CMOS Image Sensor used in the Apple iPhone 6S Smartphone Detailed Structural Analysis

The Sony 12 megapixel backside illuminated (BSI) CMOS image sensor used in the Apple iPhone 6S and 6S Plus smartphones.

TSMC 16 nm finFET Process in Apple A9 Processor - Logic Detailed Structural Analysis

The report is a detailed structural analysis (LDSA) of the Apple A9 process fabricated using TSMC�s 16 nm finFET process.

 
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CircuitVision Analysis of the Hynix H9HKNNNBTUMU LPDDR4 Mobile DRAM Memory

This CircuitVision analysis covers circuit extraction, analysis and organization of all unique circuit blocks on a single die in the SK Hynix H9HKNNNBTUMU LPDDR4 Mobile DRAM.

 
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CircuitVision Analysis of the Major Blocks on the Samsung LPDDR4 Mobile DRAM

This Circuit Vision analysis covers circuit extraction, analysis and organization of all major circuit blocks of the Samsung LPDDR4 Mobile DRAM die.

NFC NXP PN549 found in the iPhone 6s CircuitVision Analysis

TechInsights has uncovered NXP�s PN549 Near Field Communications (NFC) Controller in the Apple iPhone 6s.

Qualcomm WTR3925 Circuit Analysis

Qualcomm recently started shipping the world�s first 28 nm transceiver: the WTR3925, and we have completed full circuit analysis...

 
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TSMC 16nm finFET Process in the Apple A9 Processor Multi-Temp Transistor Characteristics

The transistor characteristics report of the TSMC 16nm finFET Process in the Apple A9 Processor provides analysis on the DC electrical properties of the logic NMOS and PMOS transistors.

Samsung 14 nm Exynos 7 SoC Multi-Temp Transistor Characteristics

The transistor characteristics report of the 14 nm Node Samsung Exynos 7 7420 SoC provides analysis on the DC electrical properties of the logic NMOS and PMOS transistors.

Samsung 3D V-NAND Flash Memory Transistor Characterization

The transistor characteristics report of the Samsung K9HQGY8S5M 3D V-NAND Flash Memory provides analysis on the DC electrical properties of the logic NMOS and PMOS transistors.

Qualcomm 20 nm node MDM9235M Modem Chipset Multi-Temp Transistor Characteristics

The Techinsights Multi-temperature transistor characteristics report provides key D.C. electrical measurements for two NMOS and two PMOS ...

Sandisk/Toshiba 15 nm 128 Gbit NAND Flash Memory Internal Waveform Analysis

The standard waveform analysis will provide details of the programming algorithm and on the internal voltages required to program, read and erase the memory cells.

Samsung 3D V-NAND Flash Memory Transistor Characterization

The probing analysis on the Toshiba (Sandisk/Toshiba) TH58TEG7DDJTA20 19 nm MLC NAND Flash will be completed on one of the dual 64 Gbit dice stacked inside the package.

Macronix MX25L6406E 64 Mbit CMOS Serial Flash Internal Waveform Analysis

This report contains detailed analysis of the Major blocks on the Macronix MX25L6406E 64Mbit CMOS Serial Flash.

Hynix H27UBG8T2ATR 32nm 32Gbit MLC NAND Flash Program Operation Internal Waveform Analysis

This Analysis includes the FIB modifications, and waveform testing for the Hynix H27UBG8T2ATR 32nm 32Gbit MLC NAND Flash.

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TechInsights originated in 1989 as Semiconductor Insights. Now, 25+ years later, we are owned by private equity – AXIO Data Group – and are headquartered in Ottawa, Canada with state of the art labs, an expansive research portfolio and over 180 employees worldwide.