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Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.
Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product.
We asked our team what they thought were the most interesting developments in their respective fields in 2017.
We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.
TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.
The phone is in and our preliminary findings have been published. Follow our blog for updates as we continue to examine this phone.
Apple, Huawei and Samsung – TechInsights has conducted an in-depth analysis of each provider’s most recent contenders.
The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.
While Apple and Samsung have been engaged in a tug-of-war for the title of top-selling smartphone provider over the past couple of years, China’s dominant OEM - Huawei - has been quietly gaining traction globally with their P- and Mate-series offerings.
Significant intellectual property has been developed around these algorithms related to error correction, read-retry techniques, wear leveling, garbage collection, data flush, and data trimming, amongst others.
TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).
3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.
Patents allow you to protect your inventions, license the use of the inventions of others, and introduce additional revenue streams to your business.
In this exclusive analysis piece, IAM provides a detailed look at each company’s patent position, as well as a summary of the big issues they have faced over the last five years.
As microchips become 3-D, there are dividends in performance, power consumption and capabilities.
It is interesting to see what the cost differences are and how much more money Apple makes by selling an X, especially when millions or tens of million units are involved.
Apple Inc’s new flagship iPhone X makes the company more money per phone than its iPhone 8 model, according to an analysis, which found the iPhone X’s flashier parts cost Apple 25 percent more than the iPhone 8, but that it retailed 43 percent higher.
Apple continues to use a mix of Qualcomm and Intel cellular baseband processors in the iPhone X. Teardowns of the handsets also show that the company employed a combination of new and old tricks to pack features into its new flagship smartphone.
Martin Bijman, Director, Intellectual Property Products, TechInsights, explores the factors involved in understanding and determining the value of your patent portfolio, concentrating closely on the importance of subject matter experts to do so.
The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.
TechInsights explored some of the Bluetooth and cellular IoT devices that it expects will dominate the Internet of Things for some time.
The 2nd Electron Devices Technology and Manufacturing (EDTM) Conference 2018 is a full four-day conference to be held in Kobe, Japan from March 13th to 16th, 2018.
Taking place in Amsterdam in March 2018, the event will provide IP owners in Europe with tools and insights that will enable them to craft world-class IP management and value creation programmes.
IPBC Korea will be a one-day event held at the JW Marriot Dongdaemun, Seoul on April 26 2018.
Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS "Motion Eye" camera offering with 960 fps video and predictive capture.
The Qualcomm RF360 Chipset includes the WTR5975 Gigabit LTE Transceiver, QET4100 Envelope Tracker and the Snapdragon X16 LTE MDM9250 Modem.
The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130.
This report is a circuit analysis of the Intel PMB5750 LTE Tranceiver. Apple’s use of the Intel modem chipset is a huge event in the industry as Intel modems will represent a minority of iPhone shipments (est. 22 M units in 2016 and 23 M units in 2017).