For over 25 years TechInsights has been a trusted patent and technology partner to the world’s largest and most successful companies including 37 of the top 50 U.S. patent holders. By revealing the innovation others can’t inside the broadest range of advanced technology products, we prove patent value and enable business leaders to make the best, fact-based IP and technology investment decisions.

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Apple iPhone X Teardown

The phone is in and our preliminary findings have been published. Follow our blog for updates as we continue to examine this phone.

Technology Blog
Samsung Read Retry for 3D NAND

Significant intellectual property has been developed around these algorithms related to error correction, read-retry techniques, wear leveling, garbage collection, data flush, and data trimming, amongst others.

Patent Intelligence Blog
Cost Comparison – Apple iPhone X, Apple iPhone 8, Huawei Mate 10, Samsung Galaxy S8

Apple, Huawei and Samsung – TechInsights has conducted an in-depth analysis of each provider’s most recent contenders.

Technology Blog
Samsung Read Retry for 3D NAND

Significant intellectual property has been developed around these algorithms related to error correction, read-retry techniques, wear leveling, garbage collection, data flush, and data trimming, amongst others.

Patent Intelligence Blog
Patent Intelligence Blog
Growth by Acquisition: Qualcomm in Talks to Acquire NXP

Read on for an analysis of what this acquisition means to the patent portfolio of Qualcomm.

Patent Intelligence Blog
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Apple iPhone X Teardown

The phone is in and our preliminary findings have been published. Follow our blog for updates as we continue to examine this phone.

Technology Blog
Huawei Mate 10 Teardown

Huawei’s Mate 10 is here, and TechInsights has torn it down to bring you our deep-dive technical analysis, board shots, costing and news of chip socket wins.

Technology Blog
Cost Comparison – Apple iPhone X, Apple iPhone 8, Huawei Mate 10, Samsung Galaxy S8

Apple, Huawei and Samsung – TechInsights has conducted an in-depth analysis of each provider’s most recent contenders.

Technology Blog
Intel/Micron 64L 3D NAND Analysis

The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

Latest Reports
TSMC 10 nm Process

TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).

Latest Reports
Intel 3D XPoint

3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.

Latest Reports
How much more is an iPhone x worth than an 8 to Apple

It is interesting to see what the cost differences are and how much more money Apple makes by selling an X, especially when millions or tens of million units are involved.

Latest News
Apple's iPhone X has higher margin than iPhone 8: analysis

Apple Inc’s new flagship iPhone X makes the company more money per phone than its iPhone 8 model, according to an analysis, which found the iPhone X’s flashier parts cost Apple 25 percent more than the iPhone 8, but that it retailed 43 percent higher.

Latest News
Apple iPhone X Packs Intel, Q’comm

Apple continues to use a mix of Qualcomm and Intel cellular baseband processors in the iPhone X. Teardowns of the handsets also show that the company employed a combination of new and old tricks to pack features into its new flagship smartphone.

Latest News
IEDM 2017, San Francisco, CA

With a history stretching back more than 60 years, the IEEE International Electron Devices Meeting (IEDM) is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology.

Latest Events
IPBC Europe, Amsterdam, Netherlands

Taking place in Amsterdam in March 2018, the event will provide IP owners in Europe with tools and insights that will enable them to craft world-class IP management and value creation programmes.

Latest Events
IPBC Global, San Francisco, CA

IPBC Global has cemented itself as the global gathering for the world’s IP business leaders since it was first held back in 2008. From June 10 to 12 2018, IPBC Global will enter its second decade when the world’s IP elite will assemble at the Palace Hotel, San Francisco for the 11th annual event.

Latest Events
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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
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Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
Memory/Selector Elements for Intel OptaneTM XPoint Memory
TechInsights has continued to dig into the process, cell structure and materials analysis of the Intel OptaneTM XPoint memory.
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Technology Blog
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10 nm Process Rollout Marching Right Along
The march continues with the Apple A10X, which is confirmed to be built on TSMC’s 10 FF process.
View Post
Technology Blog
Samsung 18 nm DRAM cell integration: QPT and higher uniformed capacitor high-k dielectrics
Samsung has begun to mass-produce their first 10 nm-class DRAM products, and we’ve taken this opportunity to analyze and compare it to the previous generations of 25 nm and 20 nm DRAM products.
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Technology Blog
SK hynix’ 21 nm DRAM Cell Technology: Comparison of 1st and 2nd generation
Low yield and reliability issues on 21 nm 1st generation, means their new 2nd generation 21 nm DRAM cell technology has caught the attention of many producers of memory products.
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Technology Blog
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A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 3: Pixel Isolation Structures)
These structures are critical to the performance of 1.0 µm to 1.4 µm generation pixels in smartphone cameras.
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Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 2: Stacked Chip Image Sensors)
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
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Technology Blog
A Survey of Enabling Technologies in Successful Consumer Digital Imaging Products (Part 1: PDAF)
This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop.
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Technology Blog