Technical Report: NVIDIA GB10 Superchip (CPU from DGX Spark) Floorplan Analysis

Analysis of NVIDIA DSE1‑275‑A1 details GB10 superchip packaging, 3 nm CPU die architecture, layout, and manufacturing cost insights.

The NVIDIA DSE1-275-A1 package is extracted from the NVIDIA GB10 superchip. The NVIDIA DGX Spark is a compact AI-powered personal desktop workstation developed by NVIDIA and introduced in October 2025 to perform AI tasks locally without accessing data center servers. It is powered by the NVIDIA GB10 Grace Blackwell Superchip processor. It contains the MediaTek AHJ11488B CPU die with "MEDIATEK 28AUG2024 AHJ11488B" die markings. According to the present and previous analyses conducted by TechInsights, the CPU die is manufactured by TSMC using its 3 nm (N3E) process technology. This analysis includes node identification, BELO stack, bit cell usage, critical dimensions, and digital blocks layout with die utilization calculations for total area for logic, I/O memory, and analog components separately. Manufacturing cost is also provided.