Advanced PMIC (Co-)Packaging Techniques in Smartphones and Smartwatches

Mobile devices are pushing PMICs to finer nodes and advanced packaging, with analysis spanning InFO, FO‑PLP, M‑Series, and module‑level PMIC integration.

Mobile technologies, such as smartphones and smartwatches, not only continue to drive PMIC die processes toward finer nodes but also drive advanced packaging to satisfy performance, feature density, efficiency, and form‑factor limits. This Featured Content builds on the selected packaging discussions in Power Semiconductor – 2026 PMIC Process Analysis Briefing 1 (BRF‑2512‑831), adding a broader technical foundation and new analysis. We examine TSMC’s Integrated Fan‑Out (InFO), Samsung’s Fan‑Out Panel‑Level Packaging (FO‑PLP), and Deca’s M‑Series packaging technologies, as well as PMICs co‑packaged in modules that integrate passives and in‑module voltage regulation (IVRs), as well as PMIC implementations within antenna‑in‑package (AiP) modules.