2026 Advanced Packaging Outlook Report
Our Semiconductor Outlook Report series provides a comprehensive look into key trends in end markets and technologies. Unlock detailed analyses, forecasts, and expert perspectives on how the semiconductor market will evolve through 2026.
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What’s Driving Advanced Packaging in 2026
Driving Innovation
Foundries expand 2.5D/3D packaging as chiplets, hybrid bonding, and new substrates enable larger, faster AI and HPC systems.
Managing Cost & Risk
Advanced packaging increases emissions and yield challenges; sustainability tools help quantify impact and manage rising risks.
Targeting High-Growth Markets
AI, mobile, and consumer demand drive strong packaging growth, supported by HBM4, chiplets, and expanding global manufacturing.
The Five Expectations for Advanced Packaging in 2026
1. Co-Packaged Optics Go Mainstream
CPO adoption accelerates as hyperscalers push for major power savings in AI networking. With TSMC integrating COUPE into CoWoS and key players preparing CPO-enabled platforms, 2026 becomes the inflection point for optical engines in high-performance systems.
2. AI’s Appetite for HBM
HBM demand continues to exceed supply as HBM4 and 16-Hi stacks roll out, raising yield and thermal risks. New custom controllers and rapid capacity expansion reshape the competitive landscape while hybrid bonding becomes essential to keeping pace with AI growth.
3. Scaling Up for Panels and Glass
Glass substrates and panel-level packaging gain momentum as device sizes expand and efficiency needs increase. With standards still emerging, 2026 is a critical year for defining processes that enable larger form factors and reduce reliance on silicon interposers.
4. Turning Up the Heat in 3D
Stacked architectures intensify thermal challenges across AI, datacenter, and consumer markets. As liquid cooling, advanced TIMs, and back-side power delivery mature, designers must rethink how to manage heat in increasingly dense and heterogeneous packages.
5. A Mobile Reconfiguration: Chiplets in the Smartphone?
Shrinking form factors and rising performance demands pressure traditional PoP designs. Chiplet concepts begin moving into mobile, with 2026 marking a potential shift toward new architectures that improve thermals and expand design flexibility.
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