Fall 2025 CMC Seminar - AI Computing propel Advanced Packaging

AI is reshaping semiconductors, pushing growth past $1T and driving new chip designs, memory integration, and advanced packaging beyond Moore’s Law.

AI is revolutionizing the semiconductor industry, driving its growth beyond the $1 trillion mark and transforming design principles with chiplets and memory integration. Essentially, AI is redefining the concept of Integrated Circuits, leading to new advancements in packaging. AI accelerators, also known as superchips, are increasing transistor counts and memory bandwidth, making advanced packaging crucial—this has become the main factor driving performance beyond Moore's Law. In this presentation, we will explore this transformative journey and examine key trends in advanced packaging that will create new opportunities for the semiconductor supply chain and material providers.