Assembly and Test Cost and Price Model
In-depth cost and price model for advanced package types including multi-die applications.
This model caters to a diverse spectrum of clientele, spanning from Integrated Device Manufacturers (IDMs) and fabless semiconductor companies to analysts, consultants, electronic systems firms, automotive enterprises, and beyond.
To understand this evolving landscape, you need a strong industry-leading business analysis tool.
Market Analysis Solutions
End Market Analysis:
The Semiconductor Manufacturing Economics Advantage
These products give any organization unique and detailed insights into the semiconductor supply chain. Customers include the world’s largest IDMs, foundries, fabless, electronics systems, automotive companies, equipment OEMs and materials suppliers, analysts, universities, and start-ups.
Supported Assembly Processes:
Leadframe, organic substrate (such as BGA, PGA, and LGA), ceramic substrate, wafer level, and InFO, including multichip and chiplet packages.
Supported Wafer Size:
75mm, 100mm, 125mm, 150mm, 200mm, and 300mm.
Supported Cost Elements:
Overall wafer sort, assembly and final test cost, assembly and tests processes, plus material usage.
Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor
TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture.
iPhone 18 Pro Max Unboxing and First Look
Watch TechInsights unbox the Apple iPhone 18 Pro Max before our experts begin detailed teardown and semiconductor analysis.
Apple iPhone 18 Pro Max Teardown: A20 Pro, X80 and Apple N1
See what TechInsights’ preliminary teardown reveals about the iPhone 18 Pro Max, including its A20 Pro processor, Qualcomm X80 modem, Apple N1, and new mmWave hardware.
The Authoritative Information Platform to the Semiconductor Industry.
