Assembly and Test Cost and Price Model
In-depth cost and price model for advanced package types including multi-die applications.
This model caters to a diverse spectrum of clientele, spanning from Integrated Device Manufacturers (IDMs) and fabless semiconductor companies to analysts, consultants, electronic systems firms, automotive enterprises, and beyond.
To understand this evolving landscape, you need a strong industry-leading business analysis tool.
Market Analysis Solutions
End Market Analysis:
The Semiconductor Manufacturing Economics Advantage
These products give any organization unique and detailed insights into the semiconductor supply chain. Customers include the world’s largest IDMs, foundries, fabless, electronics systems, automotive companies, equipment OEMs and materials suppliers, analysts, universities, and start-ups.
Supported Assembly Processes:
Leadframe, organic substrate (such as BGA, PGA, and LGA), ceramic substrate, wafer level, and InFO, including multichip and chiplet packages.
Supported Wafer Size:
75mm, 100mm, 125mm, 150mm, 200mm, and 300mm.
Supported Cost Elements:
Overall wafer sort, assembly and final test cost, assembly and tests processes, plus material usage.
Explore the latest trends in the semiconductor industry, including the rise of silicon photonics, edge AI chip impact, and advanced packaging innovations, with expert insights and forecasts.
Inside the Future of Wearables | Teardown Insights & Market Trends eBook
Discover what's powering next-gen wearables. Get teardown insights, sensor trends, and strategic analysis in our free TechInsights eBook—built for tech leaders.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
The Authoritative Information Platform to the Semiconductor Industry.
