Assembly and Test Cost and Price Model
In-depth cost and price model for advanced package types including multi-die applications.
This model caters to a diverse spectrum of clientele, spanning from Integrated Device Manufacturers (IDMs) and fabless semiconductor companies to analysts, consultants, electronic systems firms, automotive enterprises, and beyond.
The Semiconductor Manufacturing Economics Advantage
These products give any organization unique and detailed insights into the semiconductor supply chain. Customers include the world’s largest IDMs, foundries, fabless, electronics systems, automotive companies, equipment OEMs and materials suppliers, analysts, universities, and start-ups.
Supported Assembly Processes:
Leadframe, organic substrate (such as BGA, PGA, and LGA), ceramic substrate, wafer level, and InFO, including multichip and chiplet packages.
Supported Wafer Size:
75mm, 100mm, 125mm, 150mm, 200mm, and 300mm.
Supported Cost Elements:
Overall wafer sort, assembly and final test cost, assembly and tests processes, plus material usage.
Revealing the innovations others cannot inside advanced technology products
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