Semiconductor Manufacturing Economics

Assembly and Test Cost and Price Model

In-depth cost and price model for advanced package types including multi-die applications.

This model caters to a diverse spectrum of clientele, spanning from Integrated Device Manufacturers (IDMs) and fabless semiconductor companies to analysts, consultants, electronic systems firms, automotive enterprises, and beyond.

Semiconductor Manufacturing Economics

To understand this evolving landscape, you need a strong industry-leading business analysis tool.

The Semiconductor Manufacturing Economics Advantage

These products give any organization unique and detailed insights into the semiconductor supply chain. Customers include the world’s largest IDMs, foundries, fabless, electronics systems, automotive companies, equipment OEMs and materials suppliers, analysts, universities, and start-ups.
Supported Assembly Processes:

Leadframe, organic substrate (such as BGA, PGA, and LGA), ceramic substrate, wafer level, and InFO, including multichip and chiplet packages.

Supported Wafer Size:

75mm, 100mm, 125mm, 150mm, 200mm, and 300mm.

Supported Cost Elements:

Overall wafer sort, assembly and final test cost, assembly and tests processes, plus material usage.

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