5 Expectations for the Semiconductor Market in 2026
From architectural shifts to geopolitical impacts, learn what’s next for the semiconductor industry.
The semiconductor industry faces critical crossroads in 2026. AI computing is hitting memory and power bottlenecks. The transition to 2nm GAA transistors represents the biggest architectural shift in over a decade. Co-packaged optics and advanced packaging are redefining thermal management and bandwidth and escalating geopolitical tensions are fragmenting the supply chain.
What You’ll Learn:
In this session we’ll unpack five high-impact topics and their strategic implications:
AI computing bottlenecks and the technologies solving them — Including next-generation SiC and GaN power semiconductors
The 2nm transition — GAA transistors, Intel vs. TSMC vs. Samsung vs. Rapidus competition, and early customer adoption signals
Memory evolution — HBM4, the potential of high-bandwidth Flash to replace HBM, and constrained NAND supply
Thermal and bandwidth breakthroughs — Co-packaged optics, glass substrates, and advanced packaging solutions
Navigating trade turbulence — Tariffs driving supply chain relocations, China’s vertical integration for EVs, and advances in lithography tools
This webinar is essential for semiconductor professionals driving innovation, managing cost and risk, or targeting markets—including engineers, product developers, strategists, procurement leaders, and executives navigating an increasingly complex industry landscape.
Meet the presenters
Jack Narcotta
Head of Consumer Electronics Market Analysis
With over 20 years of tech sector experience, Jack helps clients find opportunities in a highly competitive and turbulent market. Jack enjoys having the ability to collaborate and provide a thorough understanding of the ripple effects produced by the rapidly changing consumer electronics market. He has a passion for uncovering the deeper stories beneath the data.
Cameron McKnight-MacNeil
Process Analyst
Cameron McKnight-MacNeil is a Process Analyst with over a decade of experience analyzing semiconductor advanced packaging technologies. He regularly analyzes high-performance compute, AI, desktop, and mobile devices, documenting how they're made and what makes them unique. Cameron holds numerous patents in advanced packaging and compound semiconductors.
David MacQueen
Service Director, Executive Programs
As the Service Director for Executive Programs, David MacQueen is tasked with covering the semiconductor value-chain to identify emerging technologies and new opportunities for research teams, while ensuring alignment across the research produced by TechInsights. He has over 20 years of experience in semiconductor-related industries and has an inherent ability to contextualize data that helps clients understand the big picture.
Dan Kim
Chief Strategy Officer
Dan Kim is a globally recognized expert and experienced leader in semiconductor markets and policy. Throughout his career, Kim has served in executive roles at semiconductor companies such as SK hynix and Qualcomm and as a senior official with the United States Government across four presidential administrations. Prior to joining TechInsights, he was chief economist and director of strategic planning and economic security at the U.S. Department of Commerce for its CHIPS for America program. While there, he set the strategic vision and implemented the $39 billion incentives program, which has since attracted more than $450 billion in capital investments.
Don’t just follow the market—lead the semiconductor industry into 2026.
Whether you’re a manufacturing strategist, foundry operator, or equipment supplier, this webinar will equip you to navigate AI infrastructure demands, environmental responsibility, and advanced packaging transitions.
Originally aired: February 4, 2026
