The PKG includes observed critical dimensions and salient features supported by the following unannotated image folders:

• Downstream product teardown
• Package photographs and X-rays
• Die photographs
• Optical planar-view images of selected PWB metal layers
• SEM and optical cross-section of the general package structure, metals, dielectric materials, and die and package interconnect structure

The image set for the report is derived from a single cross-sectioned sample. Value-added information, such as additional planes of cross-sectioning, may be included on a case-by-case basis.