This is a process flow full report that provides a Synopsys 3D emulation analysis of the process flow and integration used in the manufacture of the HiSilicon 9000s (Hi36A0 GFCV120) SoC die that powers the latest flagship smartphone, the Mate 60 Pro, from Huawei, released in September 2003 despite US sanctions. The SoC die was fabricated by Chinese foundry SMIC, using their N+2 7nm process, an advanced logic process manufactured, without extreme ultraviolet (EUV) lithography, and that fully supports full system-on-chip (SoC) functional elements like bit cells (embedded SRAM), passive elements, and more. The emulation includes SPX output files that can be used as input into other Synopsys models.an analysis and emulation of the process flow and and integration used in the manufacture and the spreadsheet lists the hundreds of process flow steps and other details required in its manufacture.