The complete APE deliverable includes:
- Detailed analyst's summary of critical device metrics, SEM and SEM-EDS of package materials, and salient features supposed by the following images:
- Downstream product teardown
- Package photographs and X-rays
- Die photographs
- Optical planar view images of selected PWB metal layers
- SEM and optical cross-section of the general package structure, metals, dielectric materials, die and package interconnect structure.





